Skip to main content Accessibility help
×
Home
Hostname: page-component-544b6db54f-n9d2k Total loading time: 0.218 Render date: 2021-10-19T04:04:37.106Z Has data issue: true Feature Flags: { "shouldUseShareProductTool": true, "shouldUseHypothesis": true, "isUnsiloEnabled": true, "metricsAbstractViews": false, "figures": true, "newCiteModal": false, "newCitedByModal": true, "newEcommerce": true, "newUsageEvents": true }

On the bending strength of single-crystal silicon theta-like specimens

Published online by Cambridge University Press:  30 May 2013

Rebecca Kirkpatrick
Affiliation:
Materials Measurement Science Division, Material Measurement Laboratory, National Institute of Standards and Technology, Gaithersburg, Maryland 20899
William A. Osborn
Affiliation:
Materials Measurement Science Division, Material Measurement Laboratory, National Institute of Standards and Technology, Gaithersburg, Maryland 20899
Michael S. Gaither
Affiliation:
Materials Measurement Science Division, Material Measurement Laboratory, National Institute of Standards and Technology, Gaithersburg, Maryland 20899
Richard S. Gates
Affiliation:
Materials Measurement Science Division, Material Measurement Laboratory, National Institute of Standards and Technology, Gaithersburg, Maryland 20899
Frank W. DelRio
Affiliation:
Materials Measurement Science Division, Material Measurement Laboratory, National Institute of Standards and Technology, Gaithersburg, Maryland 20899
Robert F. Cook*
Affiliation:
Materials Measurement Science Division, Material Measurement Laboratory, National Institute of Standards and Technology, Gaithersburg, Maryland 20899
*
Address all correspondence to Robert F. Cook atrobert.cook@nist.gov
Get access

Abstract

A new theta geometry was developed for microscale bending strength measurements. This new “gap” theta specimen was a modification of the arch theta specimen that enabled microscale tensile testing. The gap theta specimen was demonstrated here on single-crystal silicon, microfabricated using two different etch processes. The resulting sample strengths were described by three-parameter Weibull distributions derived from parameters determined using established arch theta strengths, assuming a specimen-geometry and -size invariant flaw distribution and an approximate loading configuration.

Type
Research Letters
Copyright
Copyright © Materials Research Society 2013 

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1Gaither, M.S., DelRio, F.W., Gates, R.S., Fuller, E.R. Jr., and Cook, R.F.: Strength distribution of single-crystal silicon theta-like specimens. Scripta Mater. 63, 422 (2010).CrossRefGoogle Scholar
2Durelli, A.J., Morse, S., and Parks, V.: The theta specimen for determining tensile strength of brittle materials. Mater. Res. Standards 2, 114 (1962).Google Scholar
3Fuller, E.R. Jr., Henann, D.L., and Ma, L.: Theta-like specimens for measuring mechanical properties at the small-scale: effects of non-ideal loading. Int. J. Mater. Res. 98, 729 (2007).CrossRefGoogle Scholar
4Quinn, G.D., Fuller, E., Xiang, D., Jillavenkatesa, A., Ma, L., Smith, D., and Beall, J.:A novel test method for measuring mechanical properties at the small-scale: the theta specimen, In Mechanical Properties and Performance of Engineering Ceramics and Composites, edited by Lara-Curzio, E. (Ceramic Eng. Sci. Proc. 26, Westerville, OH, 2005), p. 117.Google Scholar
5Gaither, M.S., DelRio, F.W., Gates, R.S., and Cook, R.F.: Deformation and fracture of single-crystal silicon theta-like specimens. J. Mater. Res. 26, 2575 (2011).CrossRefGoogle Scholar
6Gaither, M.S., Gates, R.S., Kirkpatrick, R., Cook, R.F., and DelRio, F.W.: Etching process effects on surface structure, fracture strength, and reliability of single-crystal silicon theta-like specimens. J. Microelectromech. Syst. (2013). DOI: 10.1109/JMEMS.2012.2234724CrossRefGoogle Scholar
7Senturia, S.D.: Microsystem Design (Kluwer Academic Publishers, Boston, 2001).Google Scholar
8Tachi, S., Tsujimoto, K., and Okudaira, S.: Low-temperature reactive ion etching and microwave plasma-etching of silicon. Appl. Phys. Lett. 52, 616 (1988).CrossRefGoogle Scholar
9Logan, D.L.: A First Course in the Finite Element Method (Thomson, Toronto, 2007).Google Scholar
10McSkimin, H.J. and Andreatch, P. Jr.: Measurement of third-order moduli of silicon and germanium. J. Appl. Phys. 35, 3312 (1964).CrossRefGoogle Scholar
11Weibull, W.: A statistical distribution function of wide applicability. J. Appl. Mech. 18, 293 (1951).Google Scholar
12Todinov, M.T.: Probability of fracture initiated by defects. Mater. Sci. Eng. A 276, 39 (2000).CrossRefGoogle Scholar
13Nemeth, N.N., Manderscheid, J.M., and Gyekenyesi, J.P.: Designing ceramic components with the CARES computer program. Amer. Ceram. Soc. Bull. 68, 2064 (1989).Google Scholar
14Weil, N.A. and Daniel, I.M.: Analysis of fracture probabilities in nonuniformly stressed brittle materials. J. Amer. Cer. Soc. 47, 268 (1964).CrossRefGoogle Scholar
15Weihs, T.P., Hong, S., Bravman, J.C., and Nix, W.D.: Mechanical deflection of cantilever microbeams: a new technique for testing the mechanical properties of thin films. J. Mater. Res. 3, 931 (1988).CrossRefGoogle Scholar

Send article to Kindle

To send this article to your Kindle, first ensure no-reply@cambridge.org is added to your Approved Personal Document E-mail List under your Personal Document Settings on the Manage Your Content and Devices page of your Amazon account. Then enter the ‘name’ part of your Kindle email address below. Find out more about sending to your Kindle. Find out more about sending to your Kindle.

Note you can select to send to either the @free.kindle.com or @kindle.com variations. ‘@free.kindle.com’ emails are free but can only be sent to your device when it is connected to wi-fi. ‘@kindle.com’ emails can be delivered even when you are not connected to wi-fi, but note that service fees apply.

Find out more about the Kindle Personal Document Service.

On the bending strength of single-crystal silicon theta-like specimens
Available formats
×

Send article to Dropbox

To send this article to your Dropbox account, please select one or more formats and confirm that you agree to abide by our usage policies. If this is the first time you use this feature, you will be asked to authorise Cambridge Core to connect with your <service> account. Find out more about sending content to Dropbox.

On the bending strength of single-crystal silicon theta-like specimens
Available formats
×

Send article to Google Drive

To send this article to your Google Drive account, please select one or more formats and confirm that you agree to abide by our usage policies. If this is the first time you use this feature, you will be asked to authorise Cambridge Core to connect with your <service> account. Find out more about sending content to Google Drive.

On the bending strength of single-crystal silicon theta-like specimens
Available formats
×
×

Reply to: Submit a response

Please enter your response.

Your details

Please enter a valid email address.

Conflicting interests

Do you have any conflicting interests? *