Hostname: page-component-7c8c6479df-7qhmt Total loading time: 0 Render date: 2024-03-29T00:23:21.224Z Has data issue: false hasContentIssue false

Metallization of High Thermal Conductivity Materials

Published online by Cambridge University Press:  31 January 2011

Get access

Extract

Great progress in LSI (large-scale integration) has been made over the past 10 years, and more rapid progress is expected in the future. In recent years, the increased circuit density in LSI devices has led to remarkable heat generation, thereby creating thermalmanagement issues for microelectronics packaging. In order to develop highperformance LSI effectively, packaging and system-level configuration of the computer must be modified to handle the heat.

Type
Research Article
Copyright
Copyright © Materials Research Society 2001

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1Niwa, K.Horikoshi, E. and Imanaka, Y.Ceramic Transactions Vol.97, Multilayer Electronic Ceramic Devices, edited by Jean, J.-H.Gupta, T.K.Nair, K.M. and Niwa, K. (American Ceramic Society, Westerville, OH, 1999) p.171.Google Scholar
2Rao, G.S.Gregg, T.A.Price, C.A.Rao, C.L. and Repka, S.J.IBM J. Res. Develop. 41 (4/5) (1997) p.397.CrossRefGoogle Scholar
3Osada, M.Amano, Y.Ogasa, N. and Ohtsuka, A., U.S., Patent No.5,086,333 (February 4, 1992).Google Scholar
4Jain, S. STMCON, Atlantic City (April 1990).Google Scholar
5Breit, H.F. and Cronin, J.E. in Proc. ISHM '93 (International Society for Hybrid Microelectronics, Montgomery, AL, 1993) p.379.Google Scholar
6Keck, S.Leighton, J. and Morgner, R.Hybrid Circuits 33 (1994) p.8.Google Scholar
7Romero, G.L. and Martinez, J.L.Int. J. Microcircuits Electron. Packaging 18 (1995) p.246.Google Scholar
8Davidson, H.L.Colella, N.J.Kerns, J.A. and Makowiecki, D. in Proc. Electronic Components and Technology Conf. (Institute of Electrical and Electronics Engineers, New York, 1995) p. 538.Google Scholar
9Iwase, N.Anzai, K.Shinozaki, K.Hirao, O.Thanh, T.D. and Sugiura, Y.IEEE Trans., Components Hybrids, Mfg. Technol. 8 (2) (1985) p. 253.CrossRefGoogle Scholar
10Yamaguchi, T. and Kageyama, M.IEEE Trans., Components Hybrids, Mfg. Technol. 12 (3)(1989) p.402.CrossRefGoogle Scholar
11Norton, M.G.J.Mater. Sci. 26 (1991) p.2322.CrossRefGoogle Scholar
12Luh, E.Y.Enloe, J.H.Dolhert, L.E.Lau, J.W.Kovacs, A.L. and Ehlert, M.R.IEEE Trans., Components Hybrids, Mfg. Technol. 14 (3) (1987) p.538.CrossRefGoogle Scholar
13Kuromitsu, Y.Yoshida, H. and Morinaga, K. in Proc. 7th European Hybrid Microelectronics Conf. (International Society for Hybrid Microelectronics, Montgomery, AL, 1989).Google Scholar
14Burgess, J.F.Neugebauer, C.A. and Flanagan, G.J. Electrochem. Soc. 122 (5) (1975) p.689.CrossRefGoogle Scholar
15Jiduo, C. in Proc. 36th Electronic Components Conf. (Institute of Electrical and Electronics Engineers, New York, 1986) p.419.Google Scholar
16Ikegami, A.Asai, T. and Suzuki, H.Ceramics 21 (3)(1986) p.207.Google Scholar
17Imanaka, Y. and Kamehara, N.J.Ceram. Soc. Jpn. 100 (4)(1992) p.560.CrossRefGoogle Scholar
18Westwood, A.D. and Notis, M.R. in Advanced Electronic Packaging Materials, edited by Barfknecht, A.T.Partridge, J.P.Chen, C.J. and Li, C.-Y. (Mater. Res. Soc. Symp. Proc. 167, Pittsburgh, 1990) p.295.Google Scholar
19Loehman, R.E. and Tomsia, A.P.Acta Metall. Mater. 40 (1992) (Suppl.) p.S75.CrossRefGoogle Scholar
20Carim, A.H. and Loehman, R.E.J. Mater. Res. 5 (7)(1990) p.1520.CrossRefGoogle Scholar
21Norton, M.G.Kajda, J.M. and B.Steele, C.H.J.Mater. Res. 5 (10) (1990) p.2172.CrossRefGoogle Scholar
22Naka, M.Tsuyoshi, M. and Okamoto, I.ISIJ Int. 30 (1990) p.1108.CrossRefGoogle Scholar
23Ferrante, M. and Pigoretti, E.J. Mater. Sci. Lett. 11 (1992) p.1687.CrossRefGoogle Scholar
24Osaka, T.Nagata, H.Nakajima, E.Koiwa, I. and Utsumi, K.J.Electrochem. Soc. 133 (11) (1986) p.2345.CrossRefGoogle Scholar
25Shafeev, G.A.Bellard, L.Themlin, J.-M.Ammar, C. Fauquet-Ben, Cros, A. and Marine, W.Appl. Phys. Lett. 68 (6)(1996) p.773.CrossRefGoogle Scholar
26Imanaka, Y. and Notis, M.R.J. Am. Ceram. Soc. 82 (6)(1999) p.1547.CrossRefGoogle Scholar
27Imanaka, Y. and Notis, M.R. (unpublished manuscript).Google Scholar