Hostname: page-component-8448b6f56d-wq2xx Total loading time: 0 Render date: 2024-04-24T01:55:27.667Z Has data issue: false hasContentIssue false

Thin -film transistors based on Zinc Oxide channel layer and Molybdenum doped Indium Oxide transparent electrodes

Published online by Cambridge University Press:  26 January 2016

Mateusz Tomasz Mądzik*
Affiliation:
Masdar Institute, Abu Dhabi, United Arab Emirates
Elangovan Elamurugu
Affiliation:
Masdar Institute, Abu Dhabi, United Arab Emirates
Raquel Flores
Affiliation:
Masdar Institute, Abu Dhabi, United Arab Emirates
Jaime Viegas
Affiliation:
Masdar Institute, Abu Dhabi, United Arab Emirates
Get access

Abstract

Thin-film transistors (TFT) were fabricated at room-temperature (RT) utilizing zinc oxide (ZnO) channel and indium molybdenum oxide (IMO) electrodes. The common bottom-gate TFTs were fabricated on commercially available thermal silicon oxide (100 nm thick) coated silicon wafers. A total of 100 devices were made in a 1 inch square area as 10 × 10 matrix, by varying the channel width and length, between 5 µm and 300 µm. Output and transfer characteristics of the fabricated devices were extracted from a semiconductor parameter analyzer. A threshold voltage (VTh) of 10 V and an ION/IOFF ratio of 1 × 10-5 were obtained. The impact of channel dimensions on the device performance was investigated, confirming that the saturation current (Isat) is directly proportional to the channel width (W), and inversely proportional to channel length (L), in agreement with field effect device theory.

Type
Articles
Copyright
Copyright © Materials Research Society 2016 

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

Elamurugu, E., Saji, K. J., Parhiban, S., Goncalves, G., Barquinha, P., Martins, R., Fortunato, E., IEEE Elect. Dev. Lett., 32 (2011) 1391.Google Scholar
Munzenrieder, N., Petti, L., Zysset, C., Salvadore, G. A., Kinkeldei, T., Perumal, C., Carta, C., Ellinger, F., Troster, G., IEDM 2012 IEEE Int., 5.2.1-5.2.4 (2012).Google Scholar
Zhao, N., Han, D., Chen, Z., Wu, J., Cong, Y., Dong, J., Zhao, F., Zhang, S., Zhang, X., Wang, Y., J. Disp. Tech., 11 (2015) 412.Google Scholar
Elangovan, E., Parthiban, S., Gonçalves, G., Franco, N., Alves, E., Martins, R., Fortunato, E., European Physics Letters, 97 (2012) 36002.Google Scholar
Elamurugu, E., Flores, R., Janeiro, R., Dahlem, M., Viegas, J., Proc. SPIE 9364 (2015).Google Scholar
Li, G., Xie, D., Feng, T., Xu, J., Zhang, X., Ren, T., Solid-State Electronics, 95 (2014) 32.Google Scholar
Streetman, B. G., Banerjee, S. K., “Solid Sate Electronic Devices, 6th edition” (Pearson Prentice Hall, New Jersey 2005) pp. 297 Google Scholar