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Embedded Niobium Using PI-2611 for Superconducting Flexible Cables

Published online by Cambridge University Press:  31 January 2017

Simin Zou ,
Yang Cao ,
George A. Hernandez ,
Rujun Bai ,
Vaibhav Gupta ,
John A. Sellers ,
Charles D. Ellis ,
David B. Tuckerman  and
Michael C. Hamilton
Simin Zou
Affiliation:
Alabama Micro/Nano Science and Technology Center, Electrical and Computer Engineering Department, Auburn University, Auburn, AL, 36849, USA.
Yang Cao
Affiliation:
Alabama Micro/Nano Science and Technology Center, Electrical and Computer Engineering Department, Auburn University, Auburn, AL, 36849, USA.
George A. Hernandez
Affiliation:
Alabama Micro/Nano Science and Technology Center, Electrical and Computer Engineering Department, Auburn University, Auburn, AL, 36849, USA.
Rujun Bai
Affiliation:
Alabama Micro/Nano Science and Technology Center, Electrical and Computer Engineering Department, Auburn University, Auburn, AL, 36849, USA.
Vaibhav Gupta
Affiliation:
Alabama Micro/Nano Science and Technology Center, Electrical and Computer Engineering Department, Auburn University, Auburn, AL, 36849, USA.
John A. Sellers
Affiliation:
Alabama Micro/Nano Science and Technology Center, Electrical and Computer Engineering Department, Auburn University, Auburn, AL, 36849, USA.
Charles D. Ellis
Affiliation:
Alabama Micro/Nano Science and Technology Center, Electrical and Computer Engineering Department, Auburn University, Auburn, AL, 36849, USA.
David B. Tuckerman
Affiliation:
Microsoft Research, Redmond, WA, 98052, USA.
Michael C. Hamilton*
Affiliation:
Alabama Micro/Nano Science and Technology Center, Electrical and Computer Engineering Department, Auburn University, Auburn, AL, 36849, USA.
*
*Corresponding Author E-mail: mch0021@auburn.edu, Tel: 334-844-1879
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Abstract

Dense, controlled-impedance, superconducting cables with small cross-sections are desirable, especially for quantum computing applications. In this study, superconductivity properties, rf microwave response and mechanical reliability performance of embedded Nb dc cables and Nb microstrip transmission line resonators with different thicknesses of polyimide PI-2611 encapsulation layers (0, 4 and 8 μm) have been investigated. Critical temperature (Tc) and critical current (Ic) of embedded Nb dc cables are ∼ 8.2 K and ∼ 0.2 A, respectively. Embedded Nb resonators yield high loaded quality factor (QL), with values as high as 14481 at ∼ 1.2 K and at a fundamental resonance of ∼ 2 GHz. From mechanical fatigue testing, we have observed that a polyimide encapsulation layer can effectively enhance the mechanical reliability of superconducting Nb flexible cables.

Keywords

Nbpolymerthin film
Type
Articles
Information
MRS Advances , Volume 2 , Issue 41: Electronics, Magnetics and Photonics , 2017 , pp. 2199 - 2204
Copyright
Copyright © Materials Research Society 2017 

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References

REFERENCES

van Weers, H.J., Kunkel, G., Lindeman, M.A. and Leeman, M., Cryogenics, 55, 1–4 (2013).CrossRefGoogle Scholar
Yung, C.S. and Moeckly, B. H., IEEE Trans. Appl. Supercond., 21(3), 107–110 (2011).Google Scholar
Tuckerman, D.B., et al. , Supercond. Sci. Technol. 29(8), 084007–0840018 (2016).CrossRefGoogle Scholar
Zou, S. et al. , IEEE Trans. Appl. Supercond., 27(4), (2017) (Available in IEEE early access)Google Scholar
Hornibrook, J.M., Colless, J. I., Mahoney, A. C., Croot, X.G., Blanvillain, S., Lu, H., Gossard, A. C. and Reilly, D. J., Appl. Phys. Lett. 104 (103108) (2014)CrossRefGoogle Scholar
Macklin, C., O’Brien, K., Hover, D., Schwartz, M.E., Bolkhovsky, V., Zhang, X., Oliver, W. D. and Siddiqi, I., Science, 350 307–310 (2015)CrossRefGoogle Scholar
HD MicroSystems 2009 PI-2600 Series-Low Stress Applications product bulletin. Available at: http://www.dupont.com/content/dam/dupont/products-and-services/electronic-and-electrical-materials/semiconductor-fabrication-and-packaging-materials/documents/PI-2600_ProcessGuide.pdf (accessed 16th November 2016).Google Scholar