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The Effect of Thermal Annealing on Cobalt Film Properties and Grain Structure

Published online by Cambridge University Press:  22 May 2020

Natalia V. Doubina ,
Tighe A. Spurlin ,
Edward C. Opocensky  and
Jonathan D. Reid
Natalia V. Doubina
Affiliation:
Lam Research Corporation, Tualatin, OR97062, U.S.A
Tighe A. Spurlin
Affiliation:
Lam Research Corporation, Tualatin, OR97062, U.S.A
Edward C. Opocensky
Affiliation:
Lam Research Corporation, Tualatin, OR97062, U.S.A
Jonathan D. Reid
Affiliation:
Lam Research Corporation, Tualatin, OR97062, U.S.A
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Abstract

The grain structure of electrodeposited Cobalt is important to device electrical and reliability performance. This paper describes thermal annealing studies performed on electroplated blanket and pattern Cobalt wafers. A systematic study of Co film properties and effect of various anneal parameters such as temperature, time, hydrogen pressure and thermal cycling was completed. Co film resistivity, purity, grain structure, phase composition and orientation as well as in-feature grain size have been characterized by various analytical methods such as XRD, STEM, SIMS and EBSD. It was observed that electroplated cobalt films with resistivity approaching bulk Cobalt value can be obtained by annealing in the temperature range of 300°C - 350°C which is favorable for hcp Co phase formation.

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Articles
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MRS Advances , Volume 5 , Issue 37-38: Electronics and Photonics , 2020 , pp. 1919 - 1927
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Copyright
Copyright © Materials Research Society 2020

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