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Mechanics of Interfacial Bonding in Dissimilar Soft Transient Materials and Electronics

Published online by Cambridge University Press:  08 June 2016

Reihaneh Jamshidi
Affiliation:
Mechanical Engineering, Iowa State University, Ames, IA 50011, U.S.A.
Yuanfen Chen
Affiliation:
Mechanical Engineering, Iowa State University, Ames, IA 50011, U.S.A.
Kathryn White
Affiliation:
Ames National Laboratory, Department of Energy, Ames, IA 50011, U.S.A.
Nicole Moehring
Affiliation:
Applied Sciences, University of Wisconsin-Stout, Menomonie, WI 54751, U.S.A.
Reza Montazami*
Affiliation:
Mechanical Engineering, Iowa State University, Ames, IA 50011, U.S.A. Ames National Laboratory, Department of Energy, Ames, IA 50011, U.S.A.
*
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Abstract

Soft transient electronics of polymeric substrates and silver-ink electronics are studied for correlated mechanical-electrical properties. Experimental and predictive finite element analysis are used to understand, explain and predict delamination, cracking, buckling, and failure of printed conductive components of such systems. An active transient polymer system consisting of poly(vinyl alcohol) and sodium bicarbonate is introduced that results in byproducts (alkaline and bubbles) when undergoing transiency. These byproducts are facilitated to control and expedite transiency of the electronic components based on redispersion of metallic nano/micro materials. Complete mechanical and electrical characterization of such systems is reported.

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Articles
Copyright
Copyright © Materials Research Society 2016 

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References

REFERENCES

Yang, J, Ghobadian, S, Goodrich, PJ, Montazami, R, Hashemi, N. Miniaturized Biological and Electrochemical Fuel Cells: Challenges and Applications. Physical Chemistry Chemical Physics. 2013;15:14147–61.CrossRefGoogle ScholarPubMed
Son, D, Lee, J, Qiao, S, Ghaffari, R, Kim, J, Lee, JE, et al. Multifunctional wearable devices for diagnosis and therapy of movement disorders. Nature Nanotechnology. 2014;9(5):397404.CrossRefGoogle Scholar
Zhang, R, Chen, Y, Montazami, R. Ionic Liquid-Doped Gel Polymer Electrolyte for Flexible Lithium-Ion Polymer Batteries. Materials. 2015;8(5):2735–48.CrossRefGoogle Scholar
Kim, D-H, Lu, N, Ma, R, Kim, Y-S, Kim, R-H, Wang, S, et al. Epidermal electronics. science. 2011;333(6044):838–43.CrossRefGoogle ScholarPubMed
Liu, S, Montazami, R, Liu, Y, Jain, V, Lin, M, Heflin, JR, et al. Layer-by-layer self-assembled conductor network composites in ionic polymer metal composite actuators with high strain response. Applied Physics Letters. 2009;95(2):023505.CrossRefGoogle Scholar
Liu, Y, Liu, S, Lin, J, Wang, D, Jain, V, Montazami, R, et al. Ion transport and storage of ionic liquids in ionic polymer conductor network composites. Applied Physics Letters. 2010;96(22):223503.CrossRefGoogle Scholar
Liu, Y, Zhao, R, Ghaffari, M, Lin, J, Liu, S, Cebeci, H, et al. Equivalent circuit modeling of ionomer and ionic polymer conductive network composite actuators containing ionic liquids. Sensors and Actuators A: Physical. 2012;181:70–6.CrossRefGoogle Scholar
Hong, W, Almomani, A, Montazami, R. Influence of ionic liquid concentration on the electromechanical performance of ionic electroactive polymer actuators. Organic Electronics. 2014;15(11):2982–7.CrossRefGoogle Scholar
Hong, W, Meis, C, Heflin, JR, Montazami, R. Evidence of counterion migration in ionic polymer actuators via investigation of electromechanical performance. Sensors and Actuators B: Chemical. 2014;205(0):371–6.CrossRefGoogle Scholar
Amiri Moghadam, AA, Hong, W, Kouzani, A, Kaynak, A, Zamani, R, Montazami, R. Nonlinear dynamic modeling of ionic polymer conductive network composite actuators using rigid finite element method. Sensors and Actuators A: Physical. 2014;217(0):168–82.CrossRefGoogle Scholar
Liu, S, Montazami, R, Liu, Y, Jain, V, Lin, M, Zhou, X, et al. Influence of the conductor network composites on the electromechanical performance of ionic polymer conductor network composite actuators. Sensors and Actuators A: Physical. 2010;157(2):267–75.CrossRefGoogle Scholar
Montazami, R, Liu, S, Liu, Y, Wang, D, Zhang, Q, Heflin, JR. Thickness dependence of curvature, strain, and response time in ionic electroactive polymer actuators fabricated via layer-by-layer assembly. Journal of Applied Physics. 2011;109(10):104301.CrossRefGoogle Scholar
Montazami, R, Wang, D, Heflin, JR. Influence of conductive network composite structure on the electromechanical performance of ionic electroactive polymer actuators. International Journal of Smart and Nano Materials. 2012;3(3):204–13.CrossRefGoogle Scholar
Meis, C, Hashemi, N, Montazami, R. Investigation of spray-coated silver-microparticle electrodes for ionic electroactive polymer actuators. Journal of Applied Physics. 2014;115(13):134302.CrossRefGoogle Scholar
Hwang, SW, Song, JK, Huang, X, Cheng, H, Kang, SK, Kim, BH, et al. High−Performance Biodegradable/Transient Electronics on Biodegradable Polymers. Advanced Materials. 2014;26(23):3905–11.CrossRefGoogle Scholar
Hernandez, HL, Kang, S-K, Lee, OP, Hwang, S-W, Kaitz, JA, Inci, B, et al. Triggered Transience of Metastable Poly(phthalaldehyde) for Transient Electronics. Advanced Materials. 2014;26(45):7637–42.CrossRefGoogle ScholarPubMed
Huang, X, Liu, Y, Hwang, SW, Kang, SK, Patnaik, D, Cortes, JF, et al. Biodegradable Materials for Multilayer Transient Printed Circuit Boards. Advanced Materials. 2014;26(43):7371–7.CrossRefGoogle Scholar
Hwang, SW, Tao, H, Kim, DH, Cheng, H, Song, JK, Rill, E, et al. A physically transient form of silicon electronics. Science. 2012 Sep 28;337(6102):1640–4. PubMed PMID: 23019646. Pubmed Central PMCID: 3786576.CrossRefGoogle Scholar
Acar, H, Banerjee, S, Shi, H, Jamshidi, R, Hashemi, N, Cho, MW, et al. Transient Biocompatible Polymeric Platforms for Long-Term Controlled Release of Therapeutic Proteins and Vaccines. Materials. 2016;9(5):321.CrossRefGoogle Scholar
Ho, P, Hahn, P, Bartha, J, Rubloff, G, Silverman, LeGoues F, et al. Chemical bonding and reaction at metal/polymer interfaces. Journal of Vacuum Science & Technology A. 1985;3(3):739–45.CrossRefGoogle Scholar
Grundmeier, G, Stratmann, M. Adhesion and de-adhesion mechanisms at polymer/metal interfaces: mechanistic understanding based on in situ studies of buried interfaces. Annu Rev Mater Res. 2005;35:571615.CrossRefGoogle Scholar
Hwang, J, Wan, A, Kahn, A. Energetics of metal–organic interfaces: new experiments and assessment of the field. Materials Science and Engineering: R: Reports. 2009;64(1):131.CrossRefGoogle Scholar
Bebensee, F, Schmid, M, Steinrück H-P, Campbell CT, Gottfried JM. Toward well-defined metal− polymer interfaces: temperature-controlled suppression of subsurface diffusion and reaction at the calcium/poly (3-hexylthiophene) interface. Journal of the American Chemical Society. 2010;132(35):12163–5.CrossRefGoogle ScholarPubMed
Çınar, S, Jamshidi, R, Chen, Y, Hashemi, N, Montazami, R. Study of mechanics of physically transient electronics: A step toward controlled transiency. Journal of Polymer Science Part B: Polymer Physics. 2016;54(4):517–24.CrossRefGoogle Scholar
Acar, H, Çınar, S, Thunga, M, Kessler, MR, Hashemi, N, Montazami, R. Study of Physically Transient Insulating Materials as a Potential Platform for Transient Electronics and Bioelectronics. Advanced Functional Materials. 2014;24(26):4135–43.CrossRefGoogle Scholar
Bai, Z, Lin, H, Imakita, K, Montazami, R, Fujii, M, Hashemi, N. Synthesis of Er3+/Yb3+ codoped NaMnF3 nanocubes with single-band red upconversion luminescence. RSC Advances. 2014;4(106):61891–7.CrossRefGoogle Scholar
Bai, Z, Lin, H, Johnson, J, Gui, SCR, Imakita, K, Montazami, R, et al. The single-band red upconversion luminescence from morphology and size controllable Er 3+/Yb 3+ doped MnF 2 nanostructures. Journal of Materials Chemistry C. 2014;2:1736–41.CrossRefGoogle Scholar
Lee, L-H. Fundamentals of adhesion: Springer Science & Business Media; 2013.
Escaig, B. Binding metals to polymers. A short review of basic physical mechanisms. Le Journal de Physique IV. 1993;3(C7):C7–753-C7-61.Google Scholar
Somorjai, GA, Li, Y. Introduction to surface chemistry and catalysis: John Wiley & Sons; 2010.Google Scholar
Goddard, JM, Hotchkiss, J. Polymer surface modification for the attachment of bioactive compounds. Progress in polymer science. 2007;32(7):698725.CrossRefGoogle Scholar
Furukawa, H, Cordova, KE, O’Keeffe, M, Yaghi, OM. The chemistry and applications of metal-organic frameworks. Science. 2013;341(6149):1230444.CrossRefGoogle ScholarPubMed
Chan, C-M, Ko, T-M, Hiraoka, H. Polymer surface modification by plasmas and photons. Surface science reports. 1996;24(1):154.CrossRefGoogle Scholar
Romero, MA, Chabert, B, Domard, A. IR spectroscopy approach for the study of interactions between an oxidized aluminium surface and a poly(propylene-g-acrylic acid) film. Journal of Applied Polymer Science. 1993;47(3):543–54.CrossRefGoogle Scholar
Flamm, DL, Auciello, O, d’Agostino, R. Plasma deposition, treatment, and etching of polymers: the treatment and etching of polymers: Elsevier; 2012.Google Scholar
Zhuang, L, Jiang, K, Zhang, G, Tang, J, Sun, R, Lee, S, editors. O 2 plasma treatment in polymer insulation process for through silicon vias. Electronic Packaging Technology (ICEPT), 2014 15th International Conference on; 2014: IEEE.
Inagaki, N, Tasaka, S, Hibi, K. Surface modification of Kapton film by plasma treatments. Journal of Polymer Science Part A: Polymer Chemistry. 1992;30(7):1425–31.CrossRefGoogle Scholar
Egitto, FD, Matienzo, LJ. Plasma modification of polymer surfaces for adhesion improvement. IBM Journal of Research and Development. 1994;38(4):423–39.CrossRefGoogle Scholar
Zhang, Y, Wang, S, Li, X, Fan, JA, Xu, S, Song, YM, et al. Experimental and theoretical studies of serpentine microstructures bonded to prestrained elastomers for stretchable electronics. Advanced Functional Materials. 2014;24(14):2028–37.CrossRefGoogle Scholar
Lacour, SP, Wagner, S, Huang, Z, Suo, Z. Stretchable gold conductors on elastomeric substrates. Applied physics letters. 2003;82(15):2404–6.CrossRefGoogle Scholar
Lacour, SP, Jones, J, Suo, Z, Wagner, S. Design and performance of thin metal film interconnects for skin-like electronic circuits. Electron Device Letters, IEEE. 2004;25(4):179–81.CrossRefGoogle Scholar
Rogers, JA, Someya, T, Huang, Y. Materials and mechanics for stretchable electronics. science. 2010;327(5973):1603–7.CrossRefGoogle ScholarPubMed
Hwang, S-W, Park, G, Edwards, C, Corbin, EA, Kang, S-K, Cheng, H, et al. Dissolution Chemistry and Biocompatibility of Single-Crystalline Silicon Nanomembranes and Associated Materials for Transient Electronics. ACS Nano. 2014 2014/06/24;8(6):5843–51.CrossRefGoogle ScholarPubMed
Kang, S-K, Hwang, S-W, Cheng, H, Yu, S, Kim, BH, Kim, J-H, et al. Dissolution Behaviors and Applications of Silicon Oxides and Nitrides in Transient Electronics. Advanced Functional Materials. 2014;24(28):4427–34.CrossRefGoogle Scholar
Jamshidi, R, Çinar, S, Chen, Y, Hashemi, N, Montazami, R. Transient bioelectronics: Electronic properties of silver microparticle-based circuits on polymeric substrates subjected to mechanical load. Journal of Polymer Science Part B: Polymer Physics. 2015;53(22):1603–10.CrossRefGoogle Scholar

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