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Microscopy and Microanalysis Microscopy and Microanalysis

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Use of Full-Field X- ray Imaging and Ptychographic X-ray Computed Tomography for the Investigation of 3D Morphology of Micro-Nano Silver Materials for Advanced Electronics Packaging Applications

Published online by Cambridge University Press:  30 July 2021

Yu-Chung Lin ,
Xiaoyang Liu ,
Kang-wei Chou ,
Esther H. R. Tsai ,
Chonghang Zhao ,
Mirko Holler ,
Ana Diaz ,
Stanislas Petrash ,
Yu-chen Karen Chen-Wiegart  and
Wah-Keat Lee
Yu-Chung Lin
Affiliation:
Stony Brook University, United States
Xiaoyang Liu
Affiliation:
Stony Brook University, United States
Kang-wei Chou
Affiliation:
Henkel KGaA, Germany
Esther H. R. Tsai
Affiliation:
Brookhaven National Lab, United States
Chonghang Zhao
Affiliation:
Stony Brook University, United States
Mirko Holler
Affiliation:
Paul Scherrer Institute, Switzerland
Ana Diaz
Affiliation:
Paul Scherrer Institute, Switzerland
Stanislas Petrash
Affiliation:
Henkel Corporation, United States
Yu-chen Karen Chen-Wiegart
Affiliation:
Stony Brook University, United States
Wah-Keat Lee
Affiliation:
Brookhaven National Lab, United States
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Type
Microscopy and Microanalysis for Real World Problem Solving
Information
Microscopy and Microanalysis , Volume 27 , Supplement S1 , August 2021 , pp. 1026 - 1027
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Copyright
Copyright © The Author(s), 2021. Published by Cambridge University Press on behalf of the Microscopy Society of America

References

Lin, Yu-Chung, Liu, Xiaoyang, Chou, Kang Wei, Tsai, Esther H. R., Zhao, Chonghang, Holler, Mirko, Diaz, Ana, Petrash, Stanislas, Chen-Wiegart, Yu-chen Karen, Adv. Eng. Mater. 2020, 1901250 Chen-Wiegart, Y.C.K., F.E. Camino, and J. Wang, Chemphyschem, 2014. 15(8): p. 1587-1591.Google Scholar
Holler, A., Diaz, M., Guizar-Sicairos, P., Karvinen, E., Farm, E., Harkonen, M., Ritala, A., Menzel, J., Raabe, O. Bunk, Sci. Rep. 2014, 4, 3857.Holler, J. Raabe, R. Wepf, S. H. Shahmoradian, A. Diaz, B. Sarafimov, T. Lachat, H. Walther, and M. Vitins, Review of Scientific Instruments 88, 113701 (2017)Google Scholar
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Use of Full-Field X- ray Imaging and Ptychographic X-ray Computed Tomography for the Investigation of 3D Morphology of Micro-Nano Silver Materials for Advanced Electronics Packaging Applications
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Use of Full-Field X- ray Imaging and Ptychographic X-ray Computed Tomography for the Investigation of 3D Morphology of Micro-Nano Silver Materials for Advanced Electronics Packaging Applications
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Use of Full-Field X- ray Imaging and Ptychographic X-ray Computed Tomography for the Investigation of 3D Morphology of Micro-Nano Silver Materials for Advanced Electronics Packaging Applications
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