Skip to main content Accessibility help
×
Home
Hostname: page-component-56f9d74cfd-h4v4t Total loading time: 0.364 Render date: 2022-06-26T01:23:25.849Z Has data issue: true Feature Flags: { "shouldUseShareProductTool": true, "shouldUseHypothesis": true, "isUnsiloEnabled": true, "useRatesEcommerce": false, "useNewApi": true }

Use of Full-Field X- ray Imaging and Ptychographic X-ray Computed Tomography for the Investigation of 3D Morphology of Micro-Nano Silver Materials for Advanced Electronics Packaging Applications

Published online by Cambridge University Press:  30 July 2021

Yu-Chung Lin
Affiliation:
Stony Brook University, United States
Xiaoyang Liu
Affiliation:
Stony Brook University, United States
Kang-wei Chou
Affiliation:
Henkel KGaA, Germany
Esther H. R. Tsai
Affiliation:
Brookhaven National Lab, United States
Chonghang Zhao
Affiliation:
Stony Brook University, United States
Mirko Holler
Affiliation:
Paul Scherrer Institute, Switzerland
Ana Diaz
Affiliation:
Paul Scherrer Institute, Switzerland
Stanislas Petrash
Affiliation:
Henkel Corporation, United States
Yu-chen Karen Chen-Wiegart
Affiliation:
Stony Brook University, United States
Wah-Keat Lee
Affiliation:
Brookhaven National Lab, United States
Rights & Permissions[Opens in a new window]

Abstract

Image of the first page of this content. For PDF version, please use the ‘Save PDF’ preceeding this image.'
Type
Microscopy and Microanalysis for Real World Problem Solving
Copyright
Copyright © The Author(s), 2021. Published by Cambridge University Press on behalf of the Microscopy Society of America

References

Lin, Yu-Chung, Liu, Xiaoyang, Chou, Kang Wei, Tsai, Esther H. R., Zhao, Chonghang, Holler, Mirko, Diaz, Ana, Petrash, Stanislas, Chen-Wiegart, Yu-chen Karen, Adv. Eng. Mater. 2020, 1901250 Chen-Wiegart, Y.C.K., F.E. Camino, and J. Wang, Chemphyschem, 2014. 15(8): p. 1587-1591.Google Scholar
Holler, A., Diaz, M., Guizar-Sicairos, P., Karvinen, E., Farm, E., Harkonen, M., Ritala, A., Menzel, J., Raabe, O. Bunk, Sci. Rep. 2014, 4, 3857.Holler, J. Raabe, R. Wepf, S. H. Shahmoradian, A. Diaz, B. Sarafimov, T. Lachat, H. Walther, and M. Vitins, Review of Scientific Instruments 88, 113701 (2017)Google Scholar
You have Access

Save article to Kindle

To save this article to your Kindle, first ensure coreplatform@cambridge.org is added to your Approved Personal Document E-mail List under your Personal Document Settings on the Manage Your Content and Devices page of your Amazon account. Then enter the ‘name’ part of your Kindle email address below. Find out more about saving to your Kindle.

Note you can select to save to either the @free.kindle.com or @kindle.com variations. ‘@free.kindle.com’ emails are free but can only be saved to your device when it is connected to wi-fi. ‘@kindle.com’ emails can be delivered even when you are not connected to wi-fi, but note that service fees apply.

Find out more about the Kindle Personal Document Service.

Use of Full-Field X- ray Imaging and Ptychographic X-ray Computed Tomography for the Investigation of 3D Morphology of Micro-Nano Silver Materials for Advanced Electronics Packaging Applications
Available formats
×

Save article to Dropbox

To save this article to your Dropbox account, please select one or more formats and confirm that you agree to abide by our usage policies. If this is the first time you used this feature, you will be asked to authorise Cambridge Core to connect with your Dropbox account. Find out more about saving content to Dropbox.

Use of Full-Field X- ray Imaging and Ptychographic X-ray Computed Tomography for the Investigation of 3D Morphology of Micro-Nano Silver Materials for Advanced Electronics Packaging Applications
Available formats
×

Save article to Google Drive

To save this article to your Google Drive account, please select one or more formats and confirm that you agree to abide by our usage policies. If this is the first time you used this feature, you will be asked to authorise Cambridge Core to connect with your Google Drive account. Find out more about saving content to Google Drive.

Use of Full-Field X- ray Imaging and Ptychographic X-ray Computed Tomography for the Investigation of 3D Morphology of Micro-Nano Silver Materials for Advanced Electronics Packaging Applications
Available formats
×
×

Reply to: Submit a response

Please enter your response.

Your details

Please enter a valid email address.

Conflicting interests

Do you have any conflicting interests? *