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Sb Grain Boundary Segregation in Rapidly Solidified Cu-Sb Alloy

Published online by Cambridge University Press:  01 August 2002

Chunfei Li ,
Masashi Watanabe ,
John Li ,
David W. Ackland  and
David B. Williams
Chunfei Li
Affiliation:
Material Science and Engineering Department, Lehigh University, Bethlehem, PA 18015
Masashi Watanabe
Affiliation:
Material Science and Engineering Department, Lehigh University, Bethlehem, PA 18015
John Li
Affiliation:
Semiconductor Research & Development Center, IBM Microelectronics, Semiconductor Research & Development Center, Hopewell Jct., NY 12533
David W. Ackland
Affiliation:
Material Science and Engineering Department, Lehigh University, Bethlehem, PA 18015
David B. Williams
Affiliation:
Material Science and Engineering Department, Lehigh University, Bethlehem, PA 18015

Abstract

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Type
Abstract
Information
Microscopy and Microanalysis , Volume 8 , Issue S02 , August 2002 , pp. 1598 - 1599
Copyright
Copyright © Microscopy Society of America 2002