Hostname: page-component-cd9895bd7-gvvz8 Total loading time: 0 Render date: 2024-12-21T14:34:27.917Z Has data issue: false hasContentIssue false

Modern STEM EBIC: Emerging Modes and Methods

Published online by Cambridge University Press:  30 July 2021

William Hubbard
Affiliation:
NanoElectronic Imaging, Inc., Los Angeles, California, United States
Matthew Mecklenburg
Affiliation:
Core Center of Excellence in Nano Imaging (CNI), University of Southern California, Los Angeles, California 90089, United States, United States
Jared Lodico
Affiliation:
Department of Physics and Astronomy, University of California, Los Angeles, California 90095, United States, United States
Brian Zutter
Affiliation:
University of California, Los Angeles, Los Angeles, California, United States
Ho Leung Chan
Affiliation:
University of California, Los Angeles, Los Angeles, California, United States
B. C. Regan
Affiliation:
Department of Physics and Astronomy, University of California, Los Angeles, California 90095, United States, United States

Abstract

Image of the first page of this content. For PDF version, please use the ‘Save PDF’ preceeding this image.'
Type
Advanced Imaging and Spectroscopy for Nanoscale Materials Characterization
Copyright
Copyright © The Author(s), 2021. Published by Cambridge University Press on behalf of the Microscopy Society of America

References

Everhart, TE, Wells, OC, and Matta, RK, Proceedings of the IEEE, 52 (1964). p. 16421647CrossRefGoogle Scholar
Hubbard, WA, et al. , Physical Review Applied, 10 (2018), p. 044066Google Scholar
Hubbard, WA et al. , Applied Physics Letters 115 (2019), p. 133502.Google Scholar
Mecklenburg, M, et al. , Ultramicroscopy, 207 (2019), p. 112852.CrossRefGoogle Scholar
Mecklenburg, M et al. , Science 347 (2015), p. 629-632.CrossRefGoogle Scholar
This material is based upon work supported by the Defense Microelectronic Activity under Contract No. HQ072720P0004, and by NSF STC award DMR-1548924 (STROBE), NSF award DMR-2004897, the UCLA PSEIF, and award 70NANB20H117 from NIST, U.S. Dept. of Commerce.Google Scholar