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In-Situ TEM Studies of the Interaction Between Dislocations in SiGe Heterostructures

Published online by Cambridge University Press:  02 July 2020

E.A. Stach
Affiliation:
National Center for Electron Microscopy, Lawrence Berkeley National Laboratory
R. Hull
Affiliation:
Department of Materials Science, University of Virginia
R.M. Tromp
Affiliation:
IBM Research Division, IBM Watson Research Center
F.M. Ross
Affiliation:
IBM Research Division, IBM Watson Research Center
M.C. Reuter
Affiliation:
IBM Research Division, IBM Watson Research Center
J.C. Bean
Affiliation:
Department of Electrical Engineering, University of Virginia
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Extract

The rate of heteroepitaxial strain relaxation via misfit dislocation introduction is strongly limited by the kinetics of dislocation nucleation, propagation and interaction. Here we describe real-time observations of the interaction between moving threading dislocations and pre-existing interfacial misfit dislocations using in-situ transmission electron microscopy. This was accomplished both during in-situ observations of the heteroepitaxial growth process using a modified ultrahigh vacuum TEM (UHV-TEM) equipped with chemical vapor deposition capabilities, as well as during in-situ anneals of metastable structures grown by molecular beam epitaxy.

In Figure 1, we present our UHV-TEM observations of the epilayer thicknesses and compositions at which dislocation interactions result in blocking of the propagating threading segment, and compare these with the theoretical predictions of Freund and those of Schwarz and Tersoff. Our results show that dislocation blocking can significantly affect the overall rate of strain relaxation in these structures. This is important, as blocked threading segments introduce undesired band gap states into electronic devices and can act as easy diffusion paths for impurities and dopants.

Type
Defects in Semiconductors
Copyright
Copyright © Microscopy Society of America

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References

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