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In-situ and Ex-situ TEM Characterization of Domain Wall-Defect Interactions Using Applied DC Bias in Bismuth Ferrite Thin Films

Published online by Cambridge University Press:  23 November 2012

M. Jablonski
Affiliation:
Materials Science and Engineering, Drexel University, Philadelphia, PA
C.R. Winkler
Affiliation:
Materials Science and Engineering, Drexel University, Philadelphia, PA
M.L. Taheri
Affiliation:
Materials Science and Engineering, Drexel University, Philadelphia, PA
A.R. Damodaran
Affiliation:
University of Illinois at Urbana Champaign, Urbana, IL
J. Karthik
Affiliation:
University of Illinois at Urbana Champaign, Urbana, IL
J.G. Wen
Affiliation:
Argonne National Laboratory, Argonne, IL
D.J. Miller
Affiliation:
Argonne National Laboratory, Argonne, IL

Abstract

Extended abstract of a paper presented at Microscopy and Microanalysis 2012 in Phoenix, Arizona, USA, July 29 – August 2, 2012.

Type
Research Article
Copyright
Copyright © Microscopy Society of America 2012

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In-situ and Ex-situ TEM Characterization of Domain Wall-Defect Interactions Using Applied DC Bias in Bismuth Ferrite Thin Films
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In-situ and Ex-situ TEM Characterization of Domain Wall-Defect Interactions Using Applied DC Bias in Bismuth Ferrite Thin Films
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In-situ and Ex-situ TEM Characterization of Domain Wall-Defect Interactions Using Applied DC Bias in Bismuth Ferrite Thin Films
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