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Predicting Fatigue Initiation Life of Sn/3.8Ag/0.7Cu Solder using Endochronic Cyclic Damage-Coupled Viscoplastic Theory

Published online by Cambridge University Press:  05 May 2011

C. F. Lee  and
Z. H. Lee
C. F. Lee*
Affiliation:
Department of Engineering Science, National Cheng-Kung University, Tainan, Taiwan 70101, R.O.C.
Z. H. Lee*
Affiliation:
Department of Engineering Science, National Cheng-Kung University, Tainan, Taiwan 70101, R.O.C.
*
*Professor
**Graduate student
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Abstract

This paper studied cyclic behavior Sn/3.8Ag/0.7Cu solder with dendritic microstructure. A cyclic damage factor D under constant strain amplitude fatigue tests, was defined by using the reducing rate of maximum cyclic tensile stress σa. The critical cyclic damage DC and it's fatigue initiation life NI were determined very consistently by using separately the experimental σavs. N curves and the percolation theory. The endochronic cyclic damage-coupled viscoplastic theory proposed by the 1st author was used to simulate cyclic stress-strain hysteresis loops with damage under strain amplitude (εa) 0.8% at 298K. The results were in very good agreement with data. Combining the evolution equation of intrinsic damage and the computed cyclic stress-inelastic strain relation, a modified Coffin-Manson relationship was derived. By setting DC = 0.3, it predicted very effectively the NI data under σa from 0.2% to 1.0%.

Keywords

Endochronic cyclic damage-coupled viscoplastic theoryEvolution equation of intrinsic damageSn/3.8Ag/0.7Cu solderCritical cyclic damageModified Coffin-Manson relationshipFatigue initiation life
Type
Articles
Information
Journal of Mechanics , Volume 24 , Issue 4 , December 2008 , pp. 369 - 377
Copyright
Copyright © The Society of Theoretical and Applied Mechanics, R.O.C. 2008

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