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Orientation imaging studies of Sn-based electronic solder joints

Published online by Cambridge University Press:  31 January 2011

A. A. Telang
Affiliation:
Department of Chemical Engineering and Materials Science, Michigan State University, East Lansing, Michigan 48824–1226
T. T. Bieler
Affiliation:
Department of Chemical Engineering and Materials Science, Michigan State University, East Lansing, Michigan 48824–1226
S. Choi
Affiliation:
Department of Chemical Engineering and Materials Science, Michigan State University, East Lansing, Michigan 48824–1226
K. K. Subramanian
Affiliation:
Department of Chemical Engineering and Materials Science, Michigan State University, East Lansing, Michigan 48824–1226
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Abstract

Single shear lap specimens were subjected to creep, isothermal aging, and thermomechanical fatigue (TMF). Scanning electron microscopy micrographs of previously polished specimens revealed changes in surface morphology. Orientation imaging microscopy was carried out on the same specimens to study the microstructural evolution and crystal orientation changes. As-fabricated joints consistently show a preferred crystal orientation with a few minority orientations with highly preferred misorientations. Alloy additions caused an increase in the number of statistically significant crystal orientations and misorientations. The solidification microstructure was unchanged due to room-temperature creep. Aging caused development and motion of well-defined subgrain boundaries and removal of most minority orientations. TMF causes heterogeneous refinement of the microstructure that accounts for the localized grain boundary sliding in regions of high strain concentration. This study implies that the lead-free solder joints are not polycrystals, but multicrystals, so that deformation is very heterogeneous and sensitive to strain and temperature history.

Type
Articles
Copyright
Copyright © Materials Research Society 2002

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References

REFERENCES

1.Yang, H., Deane, P., Magill, P., and Murty, K. Linga, Electr. Compon. Technol. Conf. (IEEE, Piscataway, NJ, 1996), p. 1136.Google Scholar
2.Frear, D.R., Grivas, D., and Morris, J.W. Jr., J. Electron. Mater. 17, 171 (1988).Google Scholar
3.Gibson, A.W., Choi, S.L., Subramanian, K.N., Bieler, T.R., in Design and Reliability of Solders and Solder Interconnections, edited by Mahidhara, R.K., Frear, D.R., Sastry, S.M.L., Murty, K.L., Liaw, P.K., and Winterbottom, W.L. (TMS, Warrendale, PA, 1997), p. 241.Google Scholar
4.Rollett, A.D., Srolovitz, D.J., Anderson, M.P., and Doherty, R.D., Acta Metall. Mater. 40, 3475 (1992).Google Scholar
5.Fan, D., Chen, L.Q., and Chen, S.P.P., J. Am. Ceram. Soc. 81, 526 (1998).Google Scholar
6.Miodownik, M., Holm, E.A., and Hassold, G.N., Scr. Mater. 42, 1173 (2000).Google Scholar
7.Holm, E.A. and Battaile, C.C., JOM 53(9), 20 (2001).CrossRefGoogle Scholar
8.Holm, E.A., Hassold, G.N., and Mioirownik, M.A., Acta Mater. 49, 2981 (2001).Google Scholar
9.Choi, S., Subramanian, K.N., Lucas, J.P., and Bieler, T.R., J. Electron. Mater. 29, 1249 (2000).Google Scholar
10.Siegelko, J., Choi, S., Subramanian, K.N., Lucas, J.P., and Bieler, T.R., J. Electron. Mater. 28, 1184 (1999).Google Scholar
11.Subramanian, K.N., Bieler, T.R., and Lucas, J.P., J. Electron. Mater. 28, 1176 (1999).Google Scholar
12.Nakamura, Y., Sakakibara, Y., Watanabe, Y., and Amamoto, Y., Soldering Surf. Mount Technol. 10, 10 (1998).Google Scholar
13.Lee, T.Y., Choi, W.J., Tu, K.N., Jang, J.W., Kuo, S.M., Jin, J.K., Frear, D.R., Zeng, K., and Kivilahti, J.K., J. Mater. Res. 17, 291 (2002).Google Scholar
14.Jensen, D. Juul, Ultramicroscopy 67, 25 (1997).Google Scholar
15.Field, D.P., Ultramicroscopy 67, 1 (1997).Google Scholar
16.Adams, B.L., Mater. Sci. Eng. A 166, 59 (1993).Google Scholar
17.Choi, S., Lee, J.G., Subramanian, K.N., Lucas, J.P., and Bieler, T.R., J. Electron. Mater. 33(4), 292, (2002).CrossRefGoogle Scholar
18.Lee, J.G., Telang, A.U., Subramamian, K.N., and Bieler, T.R., J. Electron. Mater. (in press).Google Scholar
19.Field, D.P. and Adams, B.L., Textures and Microstruct. 20, 217 (1993).CrossRefGoogle Scholar
20.Cahn, R.W. and Haasen, P., Physical Metallurgy, 4th ed. (Elsevier Science, New York, 1996), Vol. 28.Google Scholar
21.Darveaux, R. and Banerji, K., in 42nd Electronic Components and Technology Conference (ECTC) (IEEE, Piscataway, NJ, 1992), p. 538.Google Scholar
22.Choi, S., Lee, J.G., Guo, F., Bieler, T.R., Subramanian, K.N., and Lucas, J.P., JOM 53(6), 22 (2001).Google Scholar
23.Dillamore, I.L., Morris, P.L., Smith, C.J.E., and Hutchinson, B.W., Proc. R. Soc. 329A, 405 (1972).Google Scholar
24.Merkle, K.L. and Wolf, D., MRS Bull. 15(9), 42 (1990).Google Scholar
25.Rhee, H., Lucas, J.P., Subramanian, K.N., and Bieler, T.R., J. Mater. Sci. Mater. Sci.: Mater. Electron. (in press).Google Scholar
26.Gifkins, R.C., J. Mater. Charact. 32, 59 (1994).Google Scholar
27.Chokshi, A.H., Mukherjee, A.K., and Langdon, T.G., Mater. Sci. Eng. 10, 237 (1993).CrossRefGoogle Scholar
28.Bieler, T.R. and Semiatin, S.L., Int. J. Plast. (in press).Google Scholar
29.Bieler, T.R., Glavicic, M.G., and Semiatin, S.L., JOM 54(1), 31 (2002).Google Scholar