Hostname: page-component-8448b6f56d-c4f8m Total loading time: 0 Render date: 2024-04-24T23:12:49.977Z Has data issue: false hasContentIssue false

Interfacial Particle Bonding Via an Ultrathin Polymer Film on Al2O3 Nanoparticles by Plasma Polymerization

Published online by Cambridge University Press:  31 January 2011

Donglu Shi
Affiliation:
Department of Materials Science and Engineering, University of Cincinnati, Cincinnati, Ohio 45221–0012
Peng He
Affiliation:
Department of Materials Science and Engineering, University of Cincinnati, Cincinnati, Ohio 45221–0012
S. X. Wang
Affiliation:
Department of Nuclear Engineering and Radiological Science, University of Michigan, Ann Arbor, Michigan 48109
Wim J. van Ooij
Affiliation:
Department of Materials Science and Engineering, University of Cincinnati, Cincinnati, Ohio 45221–0012
L. M. Wang
Affiliation:
Department of Nuclear Engineering and Radiological Science, University of Michigan, Ann Arbor, Michigan 48109
Jiangang Zhao
Affiliation:
Department of Materials Science and Engineering, University of Cincinnati, Cincinnati, Ohio 45221–0012
Zhou Yu
Affiliation:
Department of Materials Science and Engineering, University of Cincinnati, Cincinnati, Ohio 45221–0012
Get access

Extract

To study interfacial particle-to-particle bonding mechanisms, an ultrathin film of pyrrole was deposited on alumina nanoparticles using a plasma polymerization treatment. High resolution transmission electron microscopy experiments showed that an extremely thin film of the pyrrole layer (2 nm) was uniformly deposited on the surfaces of the nanoparticles. In particular, the particles of all sizes (10–150 nm) exhibited equally uniform ultrathin films indicating well-dispersed nanoparticles in the fluidized bed during the plasma treatment. Time-of-flight secondary ion mass spectroscopy experiments confirmed the nano-surface deposition of the pyrrole films on the nanoparticles. The pyrrole-coated nanoparticles were consolidated at a temperature range (approximately 250 °C) much lower than the conventional sintering temperature. The density of consolidated bulk alumina has reached about 95% of the theoretical density of alumina with only a few percent of polymer in the matrix. After low-temperature consolidation, the micro-hardness test was performed on the bulk samples to study the strength that was related to particle-particle adhesion. The underlying adhesion mechanism for bonding of the nanoparticles is discussed.

Type
Articles
Copyright
Copyright © Materials Research Society 2002

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1.Reed, J.S., Principles of Ceramics Processing, 2nd ed. (John Wiley & Sons, Inc., New York, 1988).Google Scholar
2.Buek, J.E. and Rosolowski, J.H., in Treatise on Solid State Chemistry, edited by Hannay, N.B. (Plenum, New York, 1976), Vol. 4.Google Scholar
3.Singh, J.P., Shi, D., and Capone, D.W., Appl. Phys. Lett. 53, 239 (1987).CrossRefGoogle Scholar
4.Shi, D., Capone, D.W. II, Goudey, G.T., Singh, J.P., Zaluzec, N.J., and Goretta, K.C., Mater. Lett. 6, 217 (1988).CrossRefGoogle Scholar
5.Singh, J.P., Leu, H.J., Poeppel, R.B., Voorhees, E. van, Goudey, G.T., Winsley, K., and Shi, D., J. Appl. Phys. 66, 3154 (1989).CrossRefGoogle Scholar
6.Goretta, K.C., Lacy, O.D., Balachandran, U., Shi, D., and Routbort, J.L., J. Mater. Sci. Lett. 9, 380 (1990).CrossRefGoogle Scholar
7.Eufinger, S., Ooij, W.J. van, and Ridgway, T.H., J. Appl. Pol. Sci. 61, 1503 (1996).3.0.CO;2-R>CrossRefGoogle Scholar
8.Ooij, W.J. van, Eufinger, S., and Ridgway, T.H., Plasma and Polymers, 1, 231 (1996).Google Scholar
9.Siegel, R.W., Nanostructured Materials, 3, 1 (1993).CrossRefGoogle Scholar
10.Huntsberger, J.R., in Treatise on Adhesion and Adhesives, edited by Patrick, R.L. (Mercel Dekker, New York, 1967), Vol. 1.Google Scholar
11.Dickson, J.T., Hensen, L.C., Lee, S., Scudiero, L., and Langford, S.C., J. of Adhesion Sci. Technol., 8, 1285 (1994).CrossRefGoogle Scholar
12.Horn, R.G., Smith, D.T., and Grabbe, A., Nature 366, 442 (1993).CrossRefGoogle Scholar
13.Horn, R.G. and Smith, D.T., Science 256, 362 (1992).CrossRefGoogle Scholar
14.Israelachvili, J.N., J. Coll. Interface Sci. 44, 259 (1973).CrossRefGoogle Scholar
15.Kinloch, A.J., Adhesion and Adhesives (Chapman and Hall, London, United Kingdom, 1987).CrossRefGoogle Scholar
16.Fowkes, F.M., Ind. Eng. Chem. 56, 40 (1964).Google Scholar
17.Kinloch, A.J., Dukes, W.A., and Gledhill, R.A., in Adhesion Science and Technology, edited by Lee, L.H. (Plenum Press, New York).Google Scholar
18.Plueddemann, E.P., Silane Coupling Agents (Plenum Press, New York, 1982).CrossRefGoogle Scholar
19.Kinloch, A.J., Adhesion and Adhesives (Chapman and Hall, London, United Kingdom, 1987).CrossRefGoogle Scholar
20.Hadjipanayis, G.C. and Siegel, R.W., Nanophase materials, Synthesis-properties-applications (Kluwer Press, Dordrecht, Germany, 1994).Google Scholar
21.Whitesides, G.M., Mathias, J.P., and Seto, C.T., Science 254, 1312 (1991).CrossRefGoogle Scholar
22.Stucky, C.D. and Mac, J.E.Dougall, Science 247, 669 (1990).CrossRefGoogle Scholar
23.Gleiter, H., Nanostructured Materials, 6, 3 (1995).CrossRefGoogle Scholar
24.Wolde, A.T., Nanotechnology, ED. (STT Netherlands Study Center for Technology Trends, The Hague, The Netherlands, 1998).Google Scholar
25.Inagaki, N., Tasaka, S., and Ishii, K., J. App. Poly. Sci., 48, 1433 (1993).CrossRefGoogle Scholar
26.Bayer, C., Karches, M., Mattews, A., and Rohr, P.R. von, Chem. Eng. Technol. 21, 427 (1998).3.0.CO;2-H>CrossRefGoogle Scholar
27.McHale, J.M., Auroux, A., Perrotta, A.J., and Navrotsky, A., Science 277, 188 (1997).CrossRefGoogle Scholar