Hostname: page-component-8448b6f56d-qsmjn Total loading time: 0 Render date: 2024-04-19T22:54:03.277Z Has data issue: false hasContentIssue false
  • English
  • Français

Interfacial delamination cracking shapes and stress states during wedge indentation in a soft-film-on-hard-substrate system—Computational simulation and experimental studies

Published online by Cambridge University Press:  11 August 2011

Lei Chen ,
Kong Boon Yeap ,
Kai Yang Zeng ,
Chong Min She  and
Gui Rong Liu
Lei Chen
Affiliation:
Department of Mechanical Engineering, National University of Singapore, Singapore 117576; and Center for Advanced Computations in Engineering Science (ACES), Department of Mechanical Engineering, National University of Singapore, Singapore 117576
Kong Boon Yeap
Affiliation:
Department of Mechanical Engineering, National University of Singapore, Singapore 117576
Kai Yang Zeng*
Affiliation:
Department of Mechanical Engineering, National University of Singapore, Singapore 117576
Chong Min She
Affiliation:
Academy of Frontier Science, Nanjing University of Aeronautics and Astronautics, Nanjing 210016, China
Gui Rong Liu
Affiliation:
Center for Advanced Computations in Engineering Science (ACES), Department of Mechanical Engineering, National University of Singapore, Singapore 117576; and Singapore-MIT Alliance (SMA), Singapore, 117576
*
a)Address all correspondence to this author. e-mail: mpezk@nus.edu.sg
Get access

Abstract

The shapes of the interfacial delamination crack and stress states during wedge indentation in a soft-film-on-hard-substrate system were investigated systematically using the three-dimensional (3D) finite element simulation and wedge indentation experiment. In the simulation, a traction–separation law was used to characterize the failure behaviors of the interface. The effects of the wedge indenter tip length and the film thickness on the onset and growth of interfacial delamination were analyzed. It was shown that a two-dimensional (2D) to 3D transition of stress states occurred depending on the ratio of indenter length to film thickness. Furthermore, the interfacial delamination process by wedge indentation was conducted experimentally, and comparisons between the computational and experimental results yielded quantitative good agreement. Finally, a straightforward criterion based on the curvature of the delamination crack front was proposed to indicate the transition of stress states during the interfacial delamination. A guideline was therefore proposed to classify the 2D and 3D stress states for extracting the interface adhesion properties.

Keywords

AdhesionThin filmNanoindentation
Type
Articles
Information
Journal of Materials Research , Volume 26 , Issue 19 , 14 October 2011 , pp. 2511 - 2523
Copyright
Copyright © Materials Research Society 2011

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1.Malzbender, J., den Toonder, J.M.J., Balkenende, A.R., and de With, G.: Measuring mechanical properties of coatings: A methodology applied to nano-particle-filled sol-gel coatings on glass. Mater. Sci. Eng., R 36, 47 (2002).CrossRefGoogle Scholar
2.Kriese, M.D., Boismier, D.A., Moody, N.R., and Gerberich, W.W.: Nanomechanical fracture-testing of thin films. Eng. Fract. Mech. 61, 1 (1998).CrossRefGoogle Scholar
3.Wei, Y.G. and Hutchinson, J.W.: Mixed-mode fracture analyses of plastically-deforming adhesive joints. Int. J. Fract. 93, 315 (1998).CrossRefGoogle Scholar
4.Lane, M.: Interface fracture. Annu. Rev. Mater. Res. 33, 29 (2003).CrossRefGoogle Scholar
5.Volinsky, A.A. and Gerberich, W.W.: Nanoindentaion techniques for assessing mechanical reliability at the nano-scale. Microelectron. Eng. 69, 519 (2003).CrossRefGoogle Scholar
6.Kriese, M.D., Gerberich, W.W., and Moody, N.R.: Quantitative adhesion measures of multilayer films: Part I. Indentation mechanics. J. Mater. Res. 14, 3007 (1999).CrossRefGoogle Scholar
7.Kriese, M.D., Gerberich, W.W., and Moody, N.R.: Quantitative adhesion measures of multilayer films: Part II. Indentation of W/Cu, W/W, Cr/W. J. Mater. Res. 14, 3019 (1999).CrossRefGoogle Scholar
8.Li, X. and Bhushan, B.: A review of nanoindentation continuous stiffness measurement technique and its applications. Mater. Charact. 48, 11 (2002).CrossRefGoogle Scholar
9.Marshall, D.B. and Evans, A.G.: Measurement of adherence of residually stressed thin films by indentation. I. Mechanics of interface delamination. J. Appl. Phys. 56, 2632 (1984).CrossRefGoogle Scholar
10.Swain, M.V. and Menčik, J.: Mechanical property characterization of thin films using spherical tipped indenters. Thin Solid Films 253, 204 (1994).CrossRefGoogle Scholar
11.Volinsky, A.A., Moody, N.R., and Gerberich, W.W.: Interfacial toughness measurements for thin films on substrates. Acta Mater. 50, 441 (2002).CrossRefGoogle Scholar
12.Volinsky, A.A., Vella, J.B., and Gerberich, W.W.: Fracture toughness, adhesion and mechanical properties of low-k dielectric thin films measured by nanoindentation. Thin Solid Films 429, 201 (2003).CrossRefGoogle Scholar
13.Begley, M.R., Mumm, D.R., Evans, A.G., and Hutchinson, J.W.: Analysis of a wedge impression test for measuring the interface toughness between films/coatings and ductile substrates. Acta Mater. 48, 3211 (2000).CrossRefGoogle Scholar
14.De Boer, M.P. and Gerberich, W.W.: Microwedge indentation of the thin film fine line-I. Mechanics . Acta Mater. 44, 3169 (1996).CrossRefGoogle Scholar
15.De Boer, M.P. and Gerberich, W.W.: Microwedge indentation of the thin film fine line-II. Experiment. Acta Mater. 44, 3177 (1996).CrossRefGoogle Scholar
16.Drory, M.D. and Hutchinson, J.W.: Measurement of the adhesion of a brittle film on a ductile substrate by indentation. Proc. R. Soc. Lond., Ser. A 452, 2319 (1996).Google Scholar
17.Vlassak, J.J., Drory, M.D., and Nix, W.D.: A simple technique for measuring the adhesion of brittle films to ductile substrates with application to diamond-coated titanium. J. Mater. Res. 12, 1900 (1997).CrossRefGoogle Scholar
18.Yeap, K.B., Zeng, K.Y., Jiang, H.Y., Shen, L., and Chi, D.Z.: Determining interfacial properties of submicron low-k films on Si substrate by using wedge indentation technique. J. Appl. Phys. 101, 123531 (2007).CrossRefGoogle Scholar
19.Yeap, K.B., Zeng, K.Y., and Chi, D.Z.: Determining the interfacial toughness of low-k films on Si substrate by wedge indentation: Further studies. Acta Mater. 56, 977 (2008).CrossRefGoogle Scholar
20.Chen, L., Yeap, K.B., Zeng, K.Y., and Liu, G.R.: Finite element simulation and experimental determination of interfacial adhesion properties by wedge indentation. Philos. Mag. 89, 1395 (2009).CrossRefGoogle Scholar
21.Li, W.Z. and Siegmund, T.: An analysis of the indentation test to determine the interface toughness in a weakly bonded thin film coating substrate system. Acta Mater. 52, 2989 (2004).CrossRefGoogle Scholar
22.Zhang, Y.W., Zeng, K.Y., and Thampurun, R.: Interfacial delamination generated by indentation in thin film systems—a computational mechanics study. Mater. Sci. Eng., A 319, 893 (2001).CrossRefGoogle Scholar
23.Schulze, M. and Nix, W.D.: Finite element analysis of the wedge delamination test. Int. J. Solids Struct. 37, 1045 (2000).CrossRefGoogle Scholar
24.Tvergaard, V. and Hutchinson, J.W.: Toughness of an interface along a thin ductile layer joining elastic solids. Philos. Mag. 89, 641 (1994).CrossRefGoogle Scholar
25.Tvergaard, V. and Hutchinson, J.W.: Effect of strain-dependent cohesive zone model on predictions of crack growth resistance. Int. J. Solids Struct. 33, 3297 (1996).CrossRefGoogle Scholar
26.She, C.M., Zhang, Y.W., and Zeng, K.Y.: A three-dimensional finite element analysis of interface delamination in a ductile film/hard substrate system induced by wedge indentation. Eng. Fract. Mech. 76, 2272 (2009).CrossRefGoogle Scholar
27.Oliver, W.C. and Pharr, G.M.: An improved technique for determining hardness and elastic modulus using load and displacement sensing indentation experiments. J. Mater. Res. 7, 1564 (1992).CrossRefGoogle Scholar
28.Xu, X.P. and Needleman, A.: Numerical simulations of fast crack growth in brittle solids. J. Mech. Phys. Solids 42, 1397 (1994).CrossRefGoogle Scholar
29.ABAQUS: User Manual, Version 6.9 (SIMULIA, Providence, RI, 2009).Google Scholar
30.Johnson, K.L.: The correlation of indentation experiments. J. Mech. Phys. Solids 18, 115 (1970).CrossRefGoogle Scholar
31.Hutchinson, J.W. and Suo, Z.: Mixed mode cracking in layered materials, in Advances in Applied Mechanics, Vol. 29, edited by Hutchinson, J.W.and Wu, T.Y. (Academic Press, Burlington, 1992), pp. 63–191.Google Scholar
32.Kobayashi, S.: Differential Geometry of Complex VectorBundles (Princeton University Press, Princeton, NJ, 1987), p. 192.CrossRefGoogle Scholar
33.Zhu, J., Yeap, K.B., Zeng, K.Y., and Lu, L.: Nanomechanical characterization of sputtered RuO2 thin film on silicon substrate for solid state electronic devices. Thin Solid Films 519, 1914 (2011).CrossRefGoogle Scholar