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Improved wettability of Sn-based solder over the Cu60Zr30Ti10 bulk metallic glass surface

Published online by Cambridge University Press:  31 January 2011

A. Imai ,
M. Katayama ,
S. Maruyama ,
H. Nishikawa ,
T. Wada ,
H. Kimura ,
M. Fukuhara ,
T. Takemoto ,
A. Inoue  and
Y. Matsumoto
S. Maruyama
Affiliation:
Materials and Structures Laboratory (MSL), Tokyo Institute of Technology, Midori-ku, Yokohama 226-8503, Japan
H. Nishikawa
Affiliation:
Joining and Welding Research Institute (JWRI), Osaka University, Ibaraki, Osaka 0047, Japan
M. Fukuhara
Affiliation:
Institute for Materials Research (IMR), Tohoku University, Aoba-ku, Sendai 980-8577, Japan
T. Takemoto
Affiliation:
Joining and Welding Research Institute (JWRI), Osaka University, Ibaraki, Osaka 0047, Japan
A. Inoue
Affiliation:
Institute for Materials Research (IMR), Tohoku University, Aoba-ku, Sendai 980-8577, Japan
Y. Matsumoto*
Affiliation:
Materials and Structures Laboratory (MSL), Tokyo Institute of Technology, Midori-ku, Yokohama 226-8503, Japan
*
a) Address all correspondence to this author. e-mail: matsumoto.y.ad@m.titech.ac.jp
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Abstract

The wettability of Pb-free Sn-based solder over the Cu-based Cu60Zr30Ti10 bulk metallic glass surface was investigated. We observed that the as-polished surface was nonwetting for the solder, which was due to the surface oxide layer of ZrOx formed in air. After complete removal of the oxide layer, a thin layer of Ag was deposited on the clean Cu60Zr30Ti10 surface. The Ag-covered Cu60Zr30Ti10 surface showed relatively high resistivity to the reoxidation even in air, and thus the wettability of the Cu60Zr30Ti10 surface for the Sn-based solder was greatly improved.

Keywords

JoiningMorphologySurface chemistry
Type
Articles
Information
Journal of Materials Research , Volume 24 , Issue 9 , September 2009 , pp. 2931 - 2934
Copyright
Copyright © Materials Research Society 2009

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