Hostname: page-component-76fb5796d-x4r87 Total loading time: 0 Render date: 2024-04-25T19:07:52.232Z Has data issue: false hasContentIssue false
  • English
  • Français

Dependence of the mechanical and structural properties of (Ti,Al)N films on the nitrogen content

Published online by Cambridge University Press:  31 January 2011

C. Jiménez ,
C. Sánchez-Fernández ,
C. Morant ,
J. M. Martínez-Duart ,
M. Fernández  and
J. Sánchez-Olías
C. Jiménez
Affiliation:
Dpto. Física Aplicada C-12, Universidad Autónoma de Madrid, Cantoblanco 28049, Madrid, Spain
C. Sánchez-Fernández
Affiliation:
Dpto. Física Aplicada C-12, Universidad Autónoma de Madrid, Cantoblanco 28049, Madrid, Spain
C. Morant
Affiliation:
Dpto. Física Aplicada C-12, Universidad Autónoma de Madrid, Cantoblanco 28049, Madrid, Spain
J. M. Martínez-Duart
Affiliation:
Dpto. Física Aplicada C-12, Universidad Autónoma de Madrid, Cantoblanco 28049, Madrid, Spain
M. Fernández
Affiliation:
Inst. Ciencia de Materiales, CSIC, Cantoblanco 28049, Madrid, Spain
J. Sánchez-Olías
Affiliation:
Dpto. Corrosión y Protección, Centro Nacional de Investigación Metalúrgicas, CSIC, Avda. Gregorio del Amo, 8.28040, Madrid, Spain
Get access

Abstract

(Ti,Al)N films with increasing nitrogen content were grown by reactive cosputtering and characterized by auger electron spectroscopy, grazing x-ray diffraction, polarization curves, electrochemical impedance spectroscopy, nanoindentation, and atomic force microscopy. For Ti/Al ≈ 1 the Ti1−x AlxN phase is always present, but lower nitrogen contents lead to an additional phase, probably α–Ti(Al), which causes a decrease in hardness and Young's modulus. The increase of nitrogen content results ina decrease of surface roughness or a more compacted surface coating, according to the impedance results.

Type
Articles
Information
Journal of Materials Research , Volume 14 , Issue 7 , July 1999 , pp. 2830 - 2837
Copyright
Copyright © Materials Research Society 1999

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1.Veprěk, S. and Reiprich, S., Thin Solid Films 268, 64–71 (1995).CrossRefGoogle Scholar
2.Münz, W-D., J. Vac. Sci. Technol. A 4(6), 2717 (1986).CrossRefGoogle Scholar
3.Aromaa, J., Ronkainen, H., Mahiout, A., Hannula, S.P., Leyland, A., Matthews, A., Matthers, B., and Broszeit, E., Mat. Sci. and Engineering. A140, 722 (1991).CrossRefGoogle Scholar
4.Knotek, O., Münz, W-D., and Leyendecker, T., J. Vac. Sci. Technol. A, 5(4), 2173 (1987).CrossRefGoogle Scholar
5.Tanaka, Y., Gür, T.M., M.K., , Hagstrom, S.B., and Ikeda, T., Thin Solid Films 228, 238 (1993).CrossRefGoogle Scholar
6.Shew, B-Y. and Huang, J-L., Surf. Coat. Technol. 71, 30 (1995).CrossRefGoogle Scholar
7.Lee, S-H., Ryoo, H-J., and Lee, J-J., J. Vac. Sci. Technol. A 12(4), 1602 (1994).CrossRefGoogle Scholar
8.von Richthofen, A., Cremer, R., and Neuschütz, D., Mikrochim. Acta 125, 143–148 (1997).CrossRefGoogle Scholar
9.Dawson, T. and Tzatzov, K.K., Surf. Sci 149, 105 (1985).CrossRefGoogle Scholar
10.Rodrigo, M.T., Jiménez, C., Vázquez, L., Alonso, F., Fernández, M., and Martínez-Duart, J.M., J. Mater. Res. 13, 2117–2122 (1998).CrossRefGoogle Scholar
11.Xiao, S.Q., Foitzik, A.H., Welsch, G., Hanbold, T., and Gleitter, H., Acta Metall. Mater. 42(7), 2535 (1994).CrossRefGoogle Scholar
12.Inamura, S., Nobugai, K., and Kanamaru, F., J. Solid State Chem. 68, 124–127 (1987).CrossRefGoogle Scholar
13.Oliver, W.C. and Pharr, G.M., J. Mater. Res. 7, 1564–1583 (1992).CrossRefGoogle Scholar
14.Roos, J.R., Celis, J.P., Vancoille, E., Veltrop, H., Boelens, S., Jungblut, F., Ebberink, J., and Homberg, H., Thin Solid Films 193/194, 547 (1990).CrossRefGoogle Scholar
15.Massiani, Y., Medjahed, A., Gavier, P., Argâme, L., and Fredizzi, L., Thin Solid Films 191, 305–316 (1990).CrossRefGoogle Scholar
16.Chen, Y.L., Pitting and Surface Finishing, Jan. 1992 58–63.Google Scholar
17.Saffarian, H.M., Gan, Q., Hadkar, R., and Warren, G.W., Corrosion Science 52(8), 626–633 (1996).CrossRefGoogle Scholar
18.Hack, H.P. and Scully, J.R., J. Electrochem. Soc. 138(1), 33 (1991).CrossRefGoogle Scholar
19.Thompson, I. and Campbell, D., Corrosion Science 36(1), 187 (1994).CrossRefGoogle Scholar
20.Deflorian, F., Fedrizzi, L., and Bonora, P.L., Corrosion 50(2), 113 (1994).CrossRefGoogle Scholar
21.Mansfeld, F., J. Appl. Electrochem. 25, 187 (1995).Google Scholar
22.García, I., Conde, A., de Damborenea, J.J., and Vázquez, A.J., Thin Solid Films 310, 217 (1997).CrossRefGoogle Scholar
23.Ramesham, R. and Rose, M.F., Diamond and Related Materials 6, 17–27 (1997).CrossRefGoogle Scholar
24.Øvβri, F., Tomcsányi, L., and Túrmezey, T., Electrochimica Acta 33(3), 323 (1988).Google Scholar
25.Lucas, K.A. and Clarke, R.H., Corrosion of Aluminium-Based Metal Matrix Composites (Research Studies Press Ltd., John Wiley, New York, 1993) p. 29.Google Scholar