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Deformation characteristics of tin-based solder joints

Published online by Cambridge University Press:  03 March 2011

Antonia Antoniou  and
Ashraf F. Bastawros
Antonia Antoniou
Affiliation:
Department of Aerospace Engineering and Engineering Mechanics, Iowa State University, Ames, Iowa 50011
Ashraf F. Bastawros*
Affiliation:
Department of Aerospace Engineering and Engineering Mechanics, Iowa State University, Ames, Iowa 50011
*
a)Address all correspondence to this author. e-mail: bastaw@iastate.edu
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Abstract

A novel experimental configuration was devised to measure the evolution of the deformation field and the corresponding toughness in solder joints for microelectronic packaging. The utilized material system comprised a ductile layer of tin-based solder encapsulated within relatively hard copper shoulders. The experimental configuration provided pure shear state within the constrained solder layer. Different Pb/Sn compositions were tested with grain size approaching the film thickness. The in-plane strain distribution within the joint thickness was measured by a microscopic digital image correlation system. The toughness evolution within such highly gradient deformation field was monitored qualitatively through a two-dimensional surface scan with a nanoindentor. The measurements showed a highly inhomogeneous deformation field within the film with discreet shear bands of concentrated strain. The localized shear bands showed long-range correlations of the order 2–3 grain diameters. A size-dependent macroscopic response on the layer thickness was observed. However, the corresponding film thickness was approximately 100–1000 times larger than those predicted by nonlocal continuum theories and discreet dislocation.

Type
Articles
Information
Journal of Materials Research , Volume 18 , Issue 10 , October 2003 , pp. 2304 - 2309
Copyright
Copyright © Materials Research Society 2003

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References

REFERENCES

1.Morris, J.W., Goldstein, F.J.L., and Mei, Z., in The Mechanics of Solder Alloy Interconnects, edited by Frear, D., Morgan, H., Burchett, S., and Lau, J. (Chapman and Hall, New York, 1994).Google Scholar
2.Basaran, C. and Jiang, J., Mech. Mater. 34, 349 (2002)CrossRefGoogle Scholar
3.Dieter, G.E., Mechanical Metallurgy (McGraw-Hill, New York, 1981).Google Scholar
4.Ranieri, J.P., Lauten, F.S., and Avery, D.H., J. Electron. Mater. 24, 1419 (1995).CrossRefGoogle Scholar
5.Green, A.P., J. Mech. Phys. Solids 2, 197 (1954).CrossRefGoogle Scholar
6.Needleman, A., Acta Metall. 48, 105 (2000).Google Scholar
7.The Mechanics of Solder Alloy Interconnects, edited by Frear, D., Morgan, H., Burchett, S., and Lau, J. (Chapman and Hall, New York, 1994).Google Scholar
8.Tvergaard, V. and Hutchinson, J., J. Mech. Phys. Solids 40, 1377 (1992).CrossRefGoogle Scholar
9.Surface Displacement Analysis User Manual (Instron, Canton, MA, 1997).Google Scholar
10.Brigham, E.O., The Fast Fourier Transform (Prentice-Hall, Englewood Cliffs, NJ, 1974).Google Scholar
11.Chen, D.J., Chiang, F.P., Tan, Y.S., and Don, H.S., Appl. Opt. 32, 1839 (1993).CrossRefGoogle Scholar
12.Bastawros, A-F. and McManuis, R., Exp. Tech. 22, 35 (1998).CrossRefGoogle Scholar
13.Bastawros, A-F., Bart-Smith, H., and Evans, A.G., J. Mech. Phys. Solids 48, 301 (2000).CrossRefGoogle Scholar
14.Tabor, D., Hardness of Metals (Oxford University Press, Oxford, U.K., 1951).Google Scholar
15.Bastawros, A-F. and Kim, K-S., in Fracture and Ductile vs. Brittle Behavior, edited by Beltz, G.E., Selinger, R.L. Blumberg, Marder, M.P., and Kim, K-S. (Mater. Res. Soc. Symp. Proc. 539, Pittsburgh, PA, 1998), p. 251.Google Scholar
16.Bastawros, A-F. and Kim, K-S., J. Mech. Phys. Solids 48, 67 (2000).CrossRefGoogle Scholar
17.Callister, W., Material Science and Engineering, An Introduction (John Wiley & Sons, New York, 1999).Google Scholar
18.Meissner, H.P. and Merrill, E.W., ASTM Bull. 151, 80 (1948).Google Scholar
19.Adhesion and Adhesives Science and Technology, edited by Kinloch, A.J. (Chapman and Hall, London, U.K., 1987), p. 211.CrossRefGoogle Scholar