Skip to main content Accessibility help
×
Home
Hostname: page-component-56f9d74cfd-wh2kg Total loading time: 0.261 Render date: 2022-06-26T02:00:08.582Z Has data issue: true Feature Flags: { "shouldUseShareProductTool": true, "shouldUseHypothesis": true, "isUnsiloEnabled": true, "useRatesEcommerce": false, "useNewApi": true }

Solid-state reactions of the Ag–Cu–Ti thin film–Al2O3 substrate system

Published online by Cambridge University Press:  31 January 2011

Seiichi Suenaga
Affiliation:
Materials and Devices Laboratories, Research and Development Center, Toshiba Corporation, Kawasaki 210, Japan
Miho Koyama
Affiliation:
Materials and Devices Laboratories, Research and Development Center, Toshiba Corporation, Kawasaki 210, Japan
Shinji Arai
Affiliation:
Materials and Devices Laboratories, Research and Development Center, Toshiba Corporation, Kawasaki 210, Japan
Masako Nakahashi
Affiliation:
Materials and Devices Laboratories, Research and Development Center, Toshiba Corporation, Kawasaki 210, Japan
Get access

Abstract

A new interpretation of the reaction mechanism between active metal thin-film filler and ceramic substrate is proposed. The authors predict the possibility of prebonding reactions, prior to melting of the filler, at the interface of the system described above. To prove this, solid-state reactions of Ag–Cu–Ti thin films on sapphire substrates have been studied with Auger electron spectroscopy (AES) and x-ray diffraction (XRD). Reaction process and products have been clarified at the temperature just below the melting point of the filler. It is evident that Cu3Ti3O (diamond structure of Fd3m) is formed by the reaction between Cu3Ti and O which results from the reduction of sapphire. It seems that Cu3Ti3O contributes to bonding between metals and sapphire as an intermediate phase.

Type
Articles
Copyright
Copyright © Materials Research Society 1993

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1Loehman, R.E. and Tomsia, A. P., Ceram. Bull. 67, 375 (1988).Google Scholar
2Yano, T., Suematsu, H., and Iseki, T., J. Mater. Sci. 23, 3362 (1988).CrossRefGoogle Scholar
3Chidambaram, P.R., Edwards, G.R., and Olson, D.L., Metall. Trans. 23B, 215 (1992).Google Scholar
4Kritsalis, P., Coudurier, L., and Eustathopoulos, N., J. Mater. Sci. 26, 3400 (1991).CrossRefGoogle Scholar
5Santella, M.L., Horton, J.A., and Pak, J.J., J. Am. Ceram. Soc. 73, 1785 (1990).CrossRefGoogle Scholar
6Karlsson, N., Nature 168, 558 (1951).CrossRefGoogle Scholar
7Hansen, M. and Anderko, K., Constitution of Binary Alloys, 2nd ed. (McGraw-Hill Book Company, New York, 1985), p. 18.Google Scholar
8Niessen, A. K., Boer, F. R. De, Boom, R., Chatel, P. F. de, Mattens, W. C. M., and Miedema, A.R., CALPHAD 7, 51 (1983).CrossRefGoogle Scholar
9Andersson, S., Acta Chem. Scand. 13, 415 (1959).Google Scholar
10Yoshitake, M. and Yoshihara, K., J. Jpn. Inst. Metals 54, 778 (1990).Google Scholar
11Ohuchi, F.S. and Kohyama, M., J. Am. Ceram. Soc. 74, 1163 (1991).CrossRefGoogle Scholar
12Chamberlain, M.B., J. Vac. Sci. Technol. 15 (2), 240 (1978).CrossRefGoogle Scholar
13Karlsson, N., J. Inst. Met. 79, 391 (1951).Google Scholar

Save article to Kindle

To save this article to your Kindle, first ensure coreplatform@cambridge.org is added to your Approved Personal Document E-mail List under your Personal Document Settings on the Manage Your Content and Devices page of your Amazon account. Then enter the ‘name’ part of your Kindle email address below. Find out more about saving to your Kindle.

Note you can select to save to either the @free.kindle.com or @kindle.com variations. ‘@free.kindle.com’ emails are free but can only be saved to your device when it is connected to wi-fi. ‘@kindle.com’ emails can be delivered even when you are not connected to wi-fi, but note that service fees apply.

Find out more about the Kindle Personal Document Service.

Solid-state reactions of the Ag–Cu–Ti thin film–Al2O3 substrate system
Available formats
×

Save article to Dropbox

To save this article to your Dropbox account, please select one or more formats and confirm that you agree to abide by our usage policies. If this is the first time you used this feature, you will be asked to authorise Cambridge Core to connect with your Dropbox account. Find out more about saving content to Dropbox.

Solid-state reactions of the Ag–Cu–Ti thin film–Al2O3 substrate system
Available formats
×

Save article to Google Drive

To save this article to your Google Drive account, please select one or more formats and confirm that you agree to abide by our usage policies. If this is the first time you used this feature, you will be asked to authorise Cambridge Core to connect with your Google Drive account. Find out more about saving content to Google Drive.

Solid-state reactions of the Ag–Cu–Ti thin film–Al2O3 substrate system
Available formats
×
×

Reply to: Submit a response

Please enter your response.

Your details

Please enter a valid email address.

Conflicting interests

Do you have any conflicting interests? *