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Deposition and characterization of HfO2 high k dielectric films

Published online by Cambridge University Press:  03 March 2011

Wai Lo
Affiliation:
LSI Logic, Process Module Development, Gresham, Oregon 97030
Arvind Kamath
Affiliation:
LSI Logic, Memory Technology and Systems Integration, Milpitas, California 95035
Shreyas Kher
Affiliation:
Applied Materials, Santa Clara, California 95054
Craig Metzner
Affiliation:
Applied Materials, Santa Clara, California 95054
Jianguo Wen
Affiliation:
Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, Illinois 61801
Zhihao Chen
Affiliation:
PANalytical Inc., Tempe, Arizona 85283
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Abstract

As the scaling of complementary metal-oxide-semiconductor (CMOS) transistors proceeds, the thickness of the SiO2 gate dielectrics shrinks rapidly and results in higher gate leakage currents. High k dielectric materials are acknowledged to be the possible solutions to this challenge, as their higher k values (e.g., 15–50) raise the physical thickness of the dielectrics that provide similar equivalent thickness of a thinner SiO2 film. In order for the high k materials to be applicable in CMOS devices, there should exist deposition technologies that can deposit highly uniform films over Si wafers with diameters as large as 200 mm. This report discusses the deposition process and the correlation between the growth conditions, structural and dielectric properties of HfO2, which is one of the most promising high k dielectric materials. Judging from the thickness uniformity, surface roughness, k value, and interfacial density of state of the HfO2 films, the metalorganic chemical vapor deposition technique was identified to be suitable for growing HfO2 films targeted at applications as CMOS gate dielectrics.

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Articles
Copyright
Copyright © Materials Research Society 2004

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