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Electrokinetically enhanced cross-stream particle migration in viscoelastic flows

Published online by Cambridge University Press:  08 July 2020

Akash Choudhary ,
Di Li ,
T. Renganathan ,
Xiangchun Xuan  and
S. Pushpavanam Open the ORCID record for S. Pushpavanam [Opens in a new window]
Akash Choudhary
Affiliation:
Department of Chemical Engineering, Indian Institute of Technology Madras, TN 600036, India
Di Li
Affiliation:
Department of Mechanical Engineering, Clemson University, SC 29634-0921, USA
T. Renganathan
Affiliation:
Department of Chemical Engineering, Indian Institute of Technology Madras, TN 600036, India
Xiangchun Xuan*
Affiliation:
Department of Mechanical Engineering, Clemson University, SC 29634-0921, USA
S. Pushpavanam*
Affiliation:
Department of Chemical Engineering, Indian Institute of Technology Madras, TN 600036, India
*
†Email addresses for correspondence: xcxuan@clemson.edu, spush@iitm.ac.in
†Email addresses for correspondence: xcxuan@clemson.edu, spush@iitm.ac.in
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Abstract

Advancements in understanding the lateral migration of particles have helped in enhanced focusing in microfluidic devices. In this work, we investigate the effects of electrokinetics on particle migration in a viscoelastic flow, where the electric field is applied parallel to the flow. Through experiments and use of perturbation theory in conjunction with the reciprocal theorem, we show that the interaction of electrokinetic and rheological effects can result in an enhancement in migration by an order of magnitude. The theoretical analysis, in agreement with the experiments, demonstrates that the particles can be focused at different equilibrium positions based on their intrinsic electrical properties.

JFM classification

Micro-/Nano-fluid dynamics: Microfluidics Non-Newtonian Flows: Viscoelasticity
Type
JFM Papers
Information
Journal of Fluid Mechanics , Volume 898 , 10 September 2020 , A20
Copyright
© The Author(s), 2020. Published by Cambridge University Press

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Choudhary et al. supplementary movie 1

The movie shows the particles entering the channel, with no potential difference applied at the channel ends. The figure corresponds to fig.1 (a). Other parameters are described in the caption of Fig.1 of the main text.

Download Choudhary et al. supplementary movie 1(Video)
Video 7 MB

Choudhary et al. supplementary movie 2

The movie shows the particles exiting the channel, with no potential difference applied at the channel ends. The figure corresponds to fig.1 (a). Other parameters are described in the caption of Fig.1 of the main text.

Download Choudhary et al. supplementary movie 2(Video)
Video 7 MB

Choudhary et al. supplementary movie 3

The movie shows the particles entering the channel, with +600V potential difference applied at the channel ends. The figure corresponds to fig.1 (c). Other parameters are described in the caption of Fig.1 of the main text.

Download Choudhary et al. supplementary movie 3(Video)
Video 7 MB

Choudhary et al. supplementary movie 4

The movie shows the particles exiting the channel, with +600V potential difference applied at the channel ends. The figure corresponds to fig.1 (c). Other parameters are described in the caption of Fig.1 of the main text.

Download Choudhary et al. supplementary movie 4(Video)
Video 7 MB

Choudhary et al. supplementary movie 5

The movie shows the particles entering the channel, with -600V potential difference applied at the channel ends. The figure corresponds to fig.1 (b). Other parameters are described in the caption of Fig.1 of the main text.

Download Choudhary et al. supplementary movie 5(Video)
Video 7 MB

Choudhary et al. supplementary movie 6

The movie shows the particles exiting the channel, with -600V potential difference applied at the channel ends. The figure corresponds to fig.1 (b). Other parameters are described in the caption of Fig.1 of the main text.

Download Choudhary et al. supplementary movie 6(Video)
Video 7 MB
Supplementary material: PDF

Choudhary et al. supplementary material

Supplementary data

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Supplementary material: PDF

Choudhary et al. supplementary material

Migration code

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