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A 1-bit reconfigurable intelligent metasurface-based antenna design for 5G application

Published online by Cambridge University Press:  17 May 2023

Yajun Zhou ,
Lianfeng Chen ,
Qifei Zhang ,
Hao Wang  and
Linyan Guo Open the ORCID record for Linyan Guo [Opens in a new window]
Yajun Zhou
Affiliation:
School of Geophysics and Information Technology, China University of Geosciences, Beijing, China
Lianfeng Chen
Affiliation:
School of Geophysics and Information Technology, China University of Geosciences, Beijing, China
Qifei Zhang
Affiliation:
School of Geophysics and Information Technology, China University of Geosciences, Beijing, China
Hao Wang
Affiliation:
School of Geophysics and Information Technology, China University of Geosciences, Beijing, China
Linyan Guo*
Affiliation:
School of Geophysics and Information Technology, China University of Geosciences, Beijing, China
*
Corresponding author: Linyan Guo; Email: guoly@cugb.edu.cn
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Abstract

A 1-bit reconfigurable intelligent metasurface-based antenna for 5G application is proposed. The proposed antenna based on artificial electromagnetic metamaterial has the advantages of easy processing and low cost. This meets the requirements of future communication network development. This antenna shows that the unit cell has a stable 180° phase difference between the ON and OFF states by loading a PIN diode at 6.425–7.125 GHz. A 10 × 10 array antenna is constructed by using 2 × 2 meta-atoms to reduce the complexity of the control network. This proposed antenna can achieve ±40° beam scanning with a gain tolerance of 3 dB and a maximum gain of 18.7 dBi. In addition, beamforming performance, such as multi-beams, is also achieved. These properties ensure that the proposed antenna has great potential in wireless communication systems and microwave imaging systems.

Keywords

digital control boardpin diodereconfigurable
Type
Metamaterials and Photonic Bandgap Structures
Information
International Journal of Microwave and Wireless Technologies , Volume 15 , Special Issue 10: JNM 2022 Special Issue , December 2023 , pp. 1758 - 1767
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Copyright
© The Author(s), 2023. Published by Cambridge University Press in association with the European Microwave Association

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