Crossref Citations
This Book has been
cited by the following publications. This list is generated based on data provided by Crossref.
Leger, R. W.
and
Shen, Y.-L.
2004.
Atomistic Simulations of Dislocation-Interface Interactions in Thin Films.
MRS Proceedings,
Vol. 821,
Issue. ,
Kolesnikova, A. L.
and
Romanov *, A. E.
2004.
Misfit dislocation loops and critical parameters of quantum dots and wires.
Philosophical Magazine Letters,
Vol. 84,
Issue. 8,
p.
501.
Pech, Jérôme
Braccini, Muriel
Mortensen, Andreas
and
Eustathopoulos, Nicolas
2004.
Wetting, interfacial interactions and sticking in glass/steel systems.
Materials Science and Engineering: A,
Vol. 384,
Issue. 1-2,
p.
117.
Jung, Yeon-Gil
Pajares, Antonia
and
Lawn, Brian R.
2004.
Effect of oxide and nitride films on strength of silicon: A study using controlled small-scale flaws.
Journal of Materials Research,
Vol. 19,
Issue. 12,
p.
3569.
Rabkin, Eugen
and
Klinger, Leonid
2005.
Enhanced Diffusional Self-Healing of Polycrystalline Thin Films.
Defect and Diffusion Forum,
Vol. 237-240,
Issue. ,
p.
524.
Cao, Zhiqiang
Zhang, Tong-Yi
and
Zhang, Xin
2005.
A Nanoindentation-Based Microbridge Testing Method for Mechanical Characterization of Thin Films for MEMS Applications.
p.
221.
Zhou, Yi Chun
Jiang, Y.P.
and
Pan, Y.
2005.
Residual Stress and Stress-Strain Relationship of Electrodeposited Nickel Coatings.
Advanced Materials Research,
Vol. 9,
Issue. ,
p.
21.
Huang, Yonggang
Ngo, D.
and
Rosakis, A. J.
2005.
Non-uniform, axisymmetric misfit strain: in thin films bonded on plate substrates/substrate systems: the relation between non-uniform film stresses and system curvatures.
Acta Mechanica Sinica,
Vol. 21,
Issue. 4,
p.
362.
Iker, F.
André, N.
Pardoen, T.
and
Raskin, J.-P.
2005.
One-Mask CMOS Compatible Process for the Fabrication of Three-Dimensional Self-Assembled Thin-Film SOI Microelectromechanical Systems.
Electrochemical and Solid-State Letters,
Vol. 8,
Issue. 10,
p.
H87.
Im, S. H.
and
Huang, R.
2005.
Evolution of Wrinkles in Elastic-Viscoelastic Bilayer Thin Films.
Journal of Applied Mechanics,
Vol. 72,
Issue. 6,
p.
955.
Kassner, Michael E.
Nemat-Nasser, Sia
Suo, Zhigang
Bao, Gang
Barbour, J. Charles
Brinson, L. Catherine
Espinosa, Horacio
Gao, Huajian
Granick, Steve
Gumbsch, Peter
Kim, Kyung-Suk
Knauss, Wolfgang
Kubin, Ladislas
Langer, James
Larson, Ben C.
Mahadevan, L.
Majumdar, Arun
Torquato, Salvatore
and
van Swol, Frank
2005.
New directions in mechanics.
Mechanics of Materials,
Vol. 37,
Issue. 2-3,
p.
231.
Currie, Edwin P. K.
and
Tilley, Mark
2005.
Hybrid nanocoatings in the display industry.
Journal of the Society for Information Display,
Vol. 13,
Issue. 9,
p.
773.
Yang, Fuqian
and
Song, Wei
2005.
Influence of electromechanical interaction on the morphological instability of an elastic conducting halfspace.
Physical Review B,
Vol. 72,
Issue. 16,
Gadkari, P. R.
Warren, A. P.
Todi, R. M.
Petrova, R. V.
and
Coffey, K. R.
2005.
Comparison of the agglomeration behavior of thin metallic films on SiO2.
Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films,
Vol. 23,
Issue. 4,
p.
1152.
Duan, Kai
and
Hu, Xiao Zhi
2006.
A Simple Method for Evaluating Flaw Distributions Responsible for Size Effects in the Strength of Small-Scale Silicon Specimens.
Key Engineering Materials,
Vol. 312,
Issue. ,
p.
77.
Brown, Michal A.
Park, Tae-Soon
Rosakis, Ares
Ustundag, Ersan
Huang, Young
Tamura, Nobumichi
and
Valek, Bryan
2006.
A Comparison of X-Ray Microdiffraction and Coherent Gradient Sensing in Measuring Discontinuous Curvatures in Thin Film: Substrate Systems.
Journal of Applied Mechanics,
Vol. 73,
Issue. 5,
p.
723.
Cui, Zheng
Wang, Ling
Jin, Aizi
and
Hong, Jia-sheng
2006.
Control of Stress in Multilayered MEMS Devices.
p.
1224.
Song, Wei
and
Yang, Fuqian
2006.
Surface evolution of a stressed elastic layer in an electric field.
Journal of Physics D: Applied Physics,
Vol. 39,
Issue. 21,
p.
4634.
Chen, Kuo-Shen
2006.
MEMS/NEMS.
p.
1252.
Lee, Sang Soon
2006.
Analysis of Hygrothermal Stress in Polymeric Thin Film Combining Laser Scanning Method and Boundary Element Method.
Key Engineering Materials,
Vol. 326-328,
Issue. ,
p.
625.