Hostname: page-component-848d4c4894-wg55d Total loading time: 0 Render date: 2024-05-09T17:33:10.977Z Has data issue: false hasContentIssue false
  • English
  • Français

Stress evolution in passivated thin films of Cu on silica substrates

Published online by Cambridge University Press:  31 January 2011

Y-L. Shen ,
S. Suresh ,
M. Y. He ,
A. Bagchi ,
O. Kienzle ,
M. Rühle  and
A. G. Evans
Y-L. Shen
Affiliation:
Departments of Materials Science and Mechanical Engineering, M.I.T., Cambridge, Massachusetts 02139
S. Suresh
Affiliation:
Departments of Materials Science and Mechanical Engineering, M.I.T., Cambridge, Massachusetts 02139
M. Y. He
Affiliation:
M.I.T.–Harvard Program on Modeling of Materials, Division of Engineering and Applied Sciences, Harvard University, Cambridge, Massachusetts 02138
A. Bagchi
Affiliation:
M.I.T.–Harvard Program on Modeling of Materials, Division of Engineering and Applied Sciences, Harvard University, Cambridge, Massachusetts 02138
O. Kienzle
Affiliation:
Max Planck Institut f¨ur Metallforschung, Seestrasse 92, Stuttgart, Germany
M. Rühle
Affiliation:
Max Planck Institut f¨ur Metallforschung, Seestrasse 92, Stuttgart, Germany
A. G. Evans
Affiliation:
M.I.T.–Harvard Program of Modeling of Materials, Division of Engineering and Applied Sciences, Harvard University, Cambridge, Massachusetts 02138
Get access

Extract

Stresses supported by thin films of Cu passivated by SiOx have been measured upon thermal cycling. Very high stresses have been found, approaching 1 GPa in the thinnest (40 nm) films. Strengthening beyond yield occurs upon both cooling and heating, indicative of strong strain hardening in the Cu. The hardening continues down to at least 77 K. The yielding behavior of the Cu films has been characterized by a kinematic constitutive law, with exceptional strain hardening and a conventional temperature-dependent yield strength. The physical basis for this behavior is ascribed to confined shear bands in the Cu that induce large back stress. Transmission electron microscopy reveals aligned dislocations, which seemingly dictate the inelastic deformations in the shear bands.

Type
Articles
Information
Journal of Materials Research , Volume 13 , Issue 7 , July 1998 , pp. 1928 - 1937
Copyright
Copyright © Materials Research Society 1998

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1.Spaepen, F. and Shull, A. L., Current Opinion in Solid State & Materials Science 1, 678 (1996).Google Scholar
2.Thin Films: Stresses and Mechanical Properties I, edited by Bravman, J. C., Nix, W. D., Barnett, D. M., and Smith, D. A. (Mater. Res. Soc. Symp. Proc. 130, Pittsburgh, PA, 1989).Google Scholar
3.Thin Films: Stresses and Mechanical Properties II, edited by Doerner, M. F., Oliver, W. C., Pharr, G. M., and Fr. Brotzen (Mater. Res. Soc. Symp. Proc. 188, Pittsburgh, PA, 1990).Google Scholar
4.Thin Films: Stresses and Mechanical Properties III, edited by Nix, W. D., Bravman, J. C., Arzt, E., and Freund, L. B. (Mater. Res. Soc. Symp. Proc. 239, Pittsburgh, PA, 1992).Google Scholar
5.Thompson, C. V. and Carel, R., J. Mech. Phys. Sol. 44, 657–673 (1996).CrossRefGoogle Scholar
6.Thouless, M. D., Gupta, J., and Harper, J. M. E., J. Mater. Res. 8, 1845–1852 (1993).CrossRefGoogle Scholar
7.Besser, P. R., Brennan, S., and Bravman, J. C., J. Mater. Res. 9, 13–24 (1994).CrossRefGoogle Scholar
8.Venkatraman, R., Bravman, J. C., Nix, W. D., Davies, P. W., Flinn, P. A., and Fraser, D. B., J. Electronic Mater. 10, 1231–1237 (1990).CrossRefGoogle Scholar
9.Zielinski, E. M., Vinci, R. P., and Bravman, J. C., J. Appl. Phys. 76, 4516–4523 (1994).CrossRefGoogle Scholar
10.Shull, A. L. and Spaepen, F., J. Appl. Phys. 80, 6243–6256 (1996).CrossRefGoogle Scholar
11.Evans, A. G. and Hutchinson, J. W., Acta Metall. Mater. 43, 2507–2530 (1995).CrossRefGoogle Scholar
12.Thompson, C. V., Ann. Rev. Mater. Sci. 20, 245–268 (1990).CrossRefGoogle Scholar
13.Thompson, C. V. and Carel, R., Mater. Sci. Eng. B32, 211–219 (1995).CrossRefGoogle Scholar
14.Nix, W. D., Metall. Trans. 20A, 2217 (1989).CrossRefGoogle Scholar
15.Thouless, M. D., Acta Metall. Mater. 41, 1057–1064 (1993).Google Scholar
16.Brown, L. M. and Stobbs, W. M., Philos. Mag. 34, 351 (1976).CrossRefGoogle Scholar
17.Flinn, P. S., J. Mater. Res. 6, 1498–1501 (1991).CrossRefGoogle Scholar
18.Shen, Y-L. and Suresh, S., Acta Metall. Mater. 43, 3915–3926 (1995).CrossRefGoogle Scholar
19.Stoney, G., Proc. Roy. Soc., London, A 82, 172 (1909).Google Scholar
20.Chu, E. C., Shen, Y-L., and Suresh, S., MIT Report, November 1996.Google Scholar
21.Vinci, R. P., Zeiliski, E. M., and Bravman, J. C., Thin Solid Films 262, 142–153 (1995).CrossRefGoogle Scholar
22.Strecker, A., Salzberger, U., and Mayer, J., Prakt. Metallogr. 30, 482–495 (1993).CrossRefGoogle Scholar
23.Goodhew, P. J., in Practical Methods in Electron Microscopy, edited by Glauert, Audrey M. (Elsevier, New York, 1985).Google Scholar
24.Burke, J. E. and Turnbull, D., Progr. Met. Phys. 3, 220 (1952).CrossRefGoogle Scholar
25.Frost, H. J. and Ashby, M. F., Deformation-Mechanism (Pergamon Press, Oxford, 1982).Google Scholar
26.Drucker, D. C. and Palgen, L., J. Appl. Mech. 48, 479–485 (1981).CrossRefGoogle Scholar
27.Keller, R. M., Bader, S., Vinci, R. P., and Arzt, E., in Thin Films: Stresses and Mechanical Properties V, edited by Baker, S. P., Ross, C. A., Townsend, P. H., Volkert, C. A., and Børgesen, P. (Mater. Res. Soc. Symp. Proc. 356, Pittsburgh, PA, 1995), pp. 453–548.Google Scholar
28.Henning, C. A. O., Boswell, F. W., and Corbett, J. M., Acta Metall. 23, 177–185 (1975).CrossRefGoogle Scholar
29.Nabarro, F. R. N., Some Recent Developments in Rheology (British Rheology Club, 1950).Google Scholar
30.Cottrell, A. H., Dislocations and Plastic Flow in Crystals (Oxford Press, 1953), pp. 111–113.Google Scholar
31.Hirth, J. P. and Lothe, J., Theory of Dislocations (Wiley, New York, 1982).Google Scholar
32.Gaudette, F., Suresh, S., Dehm, G., Ruhle, M., and Evans, A. G., Acta Mater. 45, 3503–3513 (1997).CrossRefGoogle Scholar
33.Koiter, W. T., J. Appl. Mech. 32, 237 (1965).CrossRefGoogle Scholar
34.Sih, G. C., Handbook of Stress Intensity Factors (Lehigh University Press, Lehigh, PA, 1974).Google Scholar