A channel layer substitution of a wider bandgap AlGaN for a conventional GaN in high electron mobility transistors (HEMTs) is an effective method of enhancing the breakdown voltage. Wider bandgap AlGaN, however, should also increase the ohmic contact resistance. Si ion implantation doping technique was utilized to achieve sufficiently low resistive source/drain contacts. The fabricated AlGaN channel HEMTs with the field plate structure demonstrated good pinch-off operation with sufficiently high drain current density of 0.5 A/mm without noticeable current collapse. The obtained maximum breakdown voltages was 1700 V in the AlGaN channel HEMT with the gate-drain distance of 10 μm. These remarkable results indicate that AlGaN channel HEMTs could become future strong candidates for not only high-frequency devices such as low noise amplifiers but also high-power devices such as switching applications.

High-throughput experimentation is effective in systematically producing large and diverse data sets. The marriage of combinatorial materials science and informatics is a natural one, and results are beginning to emerge from the integration of elements of materials informatics with data from combinatorial libraries. We discuss data management issues in high-throughput experimentation and highlight recent examples where data-mining tools are being implemented for extracting knowledge and predicting new compounds, with an emphasis on electronic materials.

High-energy protons are generated by focusing an ultrashort pulsed high intensity laser at the Advanced Photon Research Center, JAERI-Kansai onto thin (thickness <10 μm) Tantalum targets. The laser intensities are about 4 × 1018 W/cm2. The prepulse level of the laser pulse is measured with combination of a PIN photo diode and a cross correlator and is less than 10−6. A quarter-wave plate is installed into the laser beam line to create circularly polarized pulses. Collimated high energy protons are observed with CH coated Tantalum targets irradiated with the circularly polarized laser pulses. The beam divergence of the generated proton beam is measured with a CR-39 track detector and is about 6 mrad.

We found an anomalous behavior of dopant diffusion in Si substrate during the oxynitride process. SIMS measurements showed a notably enhanced diffusion during the NO and N2O oxynitride process. The considerably enhanced diffusion was also observed in re-oxidation of oxynitride film grown by the NO annealing or NH3 nitridation of a SiO2 film. In order to simulate the enhanced diffusion, an enhancement coefficient was introduced, showing that the simulation results are in reasonable agreement with the experimental ones. We applied the diffusion model to the simulations of MOSFETs fabricated under various conditions of the oxynitride process. The device characteristics of MOSFETs were successfully reproduced by adopting a suitable dependence of nitrogen concentration CN on the surface recombination rate of interstitial Si at the oxynitride/Si substrate interface.

In this study, we evaluated the electrical properties of the bonded silicon-on-insulator (SOI) wafers with lifetime measurements using a non-contact laser-microwave method. We prepared one group that consisted of bonded SOI wafers with different active layer thicknesses (I0,30,100μm) and another group consisting of bonded SOI wafers with different buried oxide layer thicknesses(0,0.01,0.1,0.75μm). Primary mode lifetime (τ1) was measured by the photoconductivity decay (PCP) method using the laser diode (λ= 774nm) as a carrier-injected light source. Steady-state change in the conductivity was measured by the photoconductivity modulation (PCM) method using a He-Ne laser (λ = 633nm) as a carrier-injected light source. τ1 decreases as the active layer thickness decreases. The PCM intensity also decreases with decreasing active layer thickness. Surface and interface recombination rates of the SOI are increased with decreasing layer thickness. The PCM intensity also decreases as the buried layer thickness decreases.