This paper presents the mechanical characterization of both elastic and fracture properties of thin silicon films from the load-deflection response of membranes, also known as the bulge test. Properties extracted include the plane-strain modulus, prestress, fracture strength and Weibull modulus. Diaphragms made of low-temperature, hydrogenated amorphous and nanocrystalline silicon films (a-Si:H and nc-Si:H, respectively) deposited by plasma enhanced chemical vapor deposition (PECVD) and, for comparison, membranes composed of high-temperature polycrystalline silicon (poly-Si) deposited by low pressure chemical vapor deposition (LPCVD) have been fabricated and characterized. The structures are bulged until failure occurs. From the stress profiles in the diaphragms at fracture, the brittle material strength is analyzed using Weibull statistics. The bulge setup is fully automated for the sequential measurement of several membranes on a substrate realizing the high-throughput acquisition of data under well controlled conditions. A comprehensive study of the mechanical properties of low-temperature silicon films as a function of deposition parameters, namely substrate temperature, RF power, hydrogen dilution and doping, is presented.