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This paper reviews some of the research efforts in microelectronic packaging to develop composites with dimensions of the fillers ranging down to nanometer dimensions. Some initial experiments have been conducted with nanocomposites, where the thermal and dielectric properties of polymer/fumed silica composites have been studied. The bulk samples were prepared in different ratios of polymer to silica using polydimethyl siloxane and Cab-O-Sil. Differential thermal analyses carried out on these samples showed no changes in the samples till 330°C. The dielectric constant of the 70:30 (Cab-O-Sil- Polymer by Wt.%) composite is 3.8, similar to that of the pure silica. For the same composite the value of the thermal expansion coefficient is 350 ppm, closer to the value of pure polymer (439 ppm). It is suggested that the key to model these nanocomposites with ceramic and polymer phases is to understand the interfaces and their chemical bonding.
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