Conventional methods of controlling tungsten Chemical Mechanical Polishing (WCMP) processes have included blanket wafer polish rate and platen temperature monitoring. In order to enhance process control of WCMP, a second generation motor-current sense endpoint system was chosen as the evaluation tool. The endpoint detection system (Luxtron 9300) was installed on a WCMP polisher (IPEC 472) at the Motorola MOS6 facility. Endpoint algorithms were evaluated under various polishing conditions during time periods between pad changes. The data collected over 3 months led to a reliable endpoint recipe for both the contact and via WCMP process. The endpoint data compared with the conventional timed recipe, indicated that a time reduction at WCMP could be achieved, with a 10% increase in throughput. In addition, contact and via W-plug endpoint data showed a strong signal versus pattern density for given device types. In summary, the motor current endpoint system tested verified reliable endpoint, process control, and characterization capabilities.