Application to aluminum deposition using ion-plating method is described. This method has several superior features for generating highly (111) orientation. The origin of this orientation and surface roughness are discussed in connection with a kinetic energy of the ions. The film properties thus made were compared with those of a conventional sputtered film. The higher (111) oriented film showed high resistance against hillock formation even after annealing at high temperatures. An effect of a plasma cleaning of substrate surface was confirmed to be quite helpful for promotion of (111) preferred orientation.