Cu-nanoclusters can be produced in an electrochemical environment by tip-induced metal deposition using an electrochemical scanning tunneling microscope (EC-STM). These clusters, consisting of 100-1000 atoms only, show a surprising stability against anodic oxidation. The clusters, which are 2-3 atomic layers in height dissolve slowly when the applied potential is increased step by step to 200 mV positive of the reversible Nernst potential for “normal” copper dissolution. The presented work gives evidence that the unusual stability of the clusters could be a consequence of interfacial alloying between the cluster and the underlying substrate. In order to study these effects Cu-nanoclusters have been produced on pure gold substrates and on carefully prepared Au3Cu(111)-substrates. This work compares the results obtained on both substrates.