Fluorine-doped silicon dioxide, a dielectric material compatible with copper integration, has received considerable attention for applications requiring a k value in the 3.5 to 4.0 range. Given the influence of structure on desired properties, convenient experimental structural probes of this type of material are of widespread interest. This work focuses on Raman spectroscopic analyses of ring defects in fluorine-doped silicon dioxide films prepared by plasma enhanced chemical vapor deposition (PECVD) as well as high density plasma methods (HDP). These measurements are complemented by ab initio computational simulations of the ring defects in these films and the impact of nearby fluorine on their stability. The impact of aging on these structures and correlations of observed trends with experimental techniques such as X-ray fluorescence are also described.