13 results
3D Integration Using Adhesive, Metal, and Metal/Adhesive as Wafer Bonding Interfaces
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- Journal:
- MRS Online Proceedings Library Archive / Volume 1112 / 2008
- Published online by Cambridge University Press:
- 01 February 2011, 1112-E02-01
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- 2008
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Fine Keyed Alignment and Bonding for Wafer-Level 3D ICs
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- Journal:
- MRS Online Proceedings Library Archive / Volume 914 / 2006
- Published online by Cambridge University Press:
- 01 February 2011, 0914-F10-05
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- 2006
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Damascene-Patterned Metal-Adhesive (Cu-BCB) Redistribution Layers
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- Journal:
- MRS Online Proceedings Library Archive / Volume 970 / 2006
- Published online by Cambridge University Press:
- 26 February 2011, 0970-Y04-02
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- 2006
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Exploration of the Scaling Limits of 3D Integration
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- Journal:
- MRS Online Proceedings Library Archive / Volume 970 / 2006
- Published online by Cambridge University Press:
- 26 February 2011, 0970-Y02-01
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- 2006
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Low-Temperature PETEOS-to-PETEOS Wafer Bonding Using Titanium as Bonding Intermediate
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- Journal:
- MRS Online Proceedings Library Archive / Volume 914 / 2006
- Published online by Cambridge University Press:
- 01 February 2011, 0914-F03-15
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- 2006
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Mechanisms of Low-Temperature Ti/Si-Based Wafer Bonding
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- Journal:
- MRS Online Proceedings Library Archive / Volume 863 / 2005
- Published online by Cambridge University Press:
- 01 February 2011, B10.7
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- 2005
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Synthesis of Model Alumina Slurries for Damascene Patterning of Copper
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- Journal:
- MRS Online Proceedings Library Archive / Volume 671 / 2001
- Published online by Cambridge University Press:
- 18 March 2011, M2.7
- Print publication:
- 2001
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Fabrication of Air-Gaps Between Cu Interconnects for Low Intralevel k.
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- Journal:
- MRS Online Proceedings Library Archive / Volume 612 / 2000
- Published online by Cambridge University Press:
- 17 March 2011, D4.8.1
- Print publication:
- 2000
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Chemical-Mechanical Polishing of Polymer Films: Comparison of Benzocyclobutene(BCB) and Parylene-N Films by XPS and AFM
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- Journal:
- MRS Online Proceedings Library Archive / Volume 476 / 1997
- Published online by Cambridge University Press:
- 15 February 2011, 161
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- 1997
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Low Dielectric Constant Polymers For On-Chip Interlevel Dielectrics With Copper Metallization
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- Journal:
- MRS Online Proceedings Library Archive / Volume 381 / 1995
- Published online by Cambridge University Press:
- 15 February 2011, 177
- Print publication:
- 1995
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Copper Metallization Manufacturing Issues for Future ICs
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- Journal:
- MRS Online Proceedings Library Archive / Volume 337 / 1994
- Published online by Cambridge University Press:
- 25 February 2011, 41
- Print publication:
- 1994
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Electrical Properties of Sipos Films Deposited on Crystalline Silicon
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- Journal:
- MRS Online Proceedings Library Archive / Volume 164 / 1989
- Published online by Cambridge University Press:
- 21 February 2011, 383
- Print publication:
- 1989
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Viscoelastic Stress Relief in Patterned Silicon-on-Insulator Structures
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- Journal:
- MRS Online Proceedings Library Archive / Volume 130 / 1988
- Published online by Cambridge University Press:
- 22 February 2011, 327
- Print publication:
- 1988
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