Low density Sn doped resorcinol formaldehyde aerogels were fabricated for extreme ultraviolet (EUV) source emission lithography experiments (EUVL). EUVL is a candidate to succeed conventional optical lithography. EUVL requires a reliable emission (13.5 nm) source. One type of source is a laser-produced plasma. Several laser-plasma source materials have been considered such as lithium, xenon and tin. Tin is considered ideal because it has a high conversion effeciency. However, solid tin targets create a large quantity of debris which can damage the optics of the laser system. As a solution to this problem, we minimized the amount of tin by dispersing it in a low density resorcinol formaldehyde (R/F) matrix. These targets were fabricated into small spheres using the microencapsulation method. Initial experimental results show that these targets yield a similar intensity in the EUV regime when compred to a full density Sn target.