To lower the cost of multichip module packaging, hybridized substrate technologies have recently been reported which blend the desirable aspects of D and L fabrication (MCM-D/L). High performance dielectrics such as Cyclotene™3022 and photosensitive BCB have been shown to be compatible with laminate substrates used in MCM-DIL, however the cure levels of the dielectric on the laminates must be known for optimum processing.
In this paper, the capability of attenuated reflection IR microscopy (micro-ATR-IR) to probe thin films of BCB polymers is demonstrated. This technique enables the polymer layer to be probed regardless of the characteristics of the substrate. Cure levels of both Cyclotene™ 3022 and photodefinable BCB polymer films are obtained with micro-ATR-IR on both silicon and laminate substrate. Micro-ATR-IR is also used to probe a rapid thermal cure of Cyclotene Tm 3022 and photodefinable BCB layers on copper-clad polyimide laminate; these measurements cannot be made with transmission IR due to the high reflectivity of the substrate.