The stiff SiNx gate dielectric in conventional amorphous silicon thin film transistors (TFTs) limits their flexibility by brittle fracture when in tension. We report the effect on the overall flexibility of TFTs of replacing the brittle SiNx gate dielectric with a new, resilient SiO2-silicone hybrid material, which is deposited by plasma enhanced chemical vapor deposition. Individual TFTs on a 50μm-thick polyimide foil were bent to known radii, and measurement of transfer characteristics were made both during strain and after re-flattening. Compared with conventional TFTs made with SiNx, TFTs made with the new hybrid material demonstrated similar flexibility when strained in compression and significantly increased flexibility when strained in tension. Under bending to compressive strain, all TFTs tested delaminated from the substrate for compressive strains greater than 2%. Conventional a-Si:H/SiNx TFTs have been previously found to delaminate at a similar compressive strain. Under bending to tensile strain, the most flexible TFTs made with the new hybrid material that were tested after re-flattening did not exhibit significant changes in transfer characteristics up to strains of ∼2.5%. Conventional a-Si:H/SiNx TFTs have been found to remain functional for strains of up to 0.5%, a value only one-fifth of that for TFTs made with the new hybrid material.