We report the development of a metallic colloid sintering process enabling the creation of bonding layers at moderate temperatures ranging from 150°C to 300°C, and pressures lower than 5MPa. This colloidal n-propyl acetate dispersion of Ag nanoparticles, having an average size distribution of 103nm, was used in sintered interconnect fabrication. Open air sintering of a 10um thick film resulted in an average resistivity of 0.20·10−6 −0.30·10−6 Ωm. Film resistances were found to be as low as 0.18·10−6 Ωm. Independent test varying either pressure or temperature were correlated to ultimate shear strength and modulus. The analysis of a 1cm2 bond area resulted in a peak shear strength of 5.83 MPa and shear modulus of 346 MPa which occurred following bonding at 300°C with a pressure of 4.219 MPa.