Stealth dicing appears to be the appropriate methode to singulate surface sensitive microelectromechanical devices, without producing dicing debris or using water jet. The operating mode of the stealth dicing will be explained. A three dimensional integration project with open micromachined structures is taken as a reference to evaluate the advantages and limitations of this new dicing method. The preconditions for successful singulations will be discussed. Optical and SEM inspection results after successful separation will be discussed.