Feasibility of multiwavelength Raman spectroscopy was studied as a potential in-line monitoring technique for grain size distribution in channel poly-Si used in three dimensional stacked NAND (3D NAND) Flash memory devices. Various channel poly-Si materials in 3D-NAND Flash memory devices, converted from chemical vapor deposition (CVD) grown a-Si, were characterized using non-contact, multiwavelength Raman spectroscopy and high resolution cross-sectional transmission electron microscopy (HRXTEM). The Raman characterization results were compared with HRXTEM images. The correlation between the grain size distribution characterized by multiwavelength Raman spectroscopy and “on current” (ION) of 3D NAND Flash memory devices was investigated. Good correlation between these techniques was seen. Multiwavelength Raman spectroscopy is very promising as a non-destructive in-line monitoring technique for grain size distribution in channel poly-Si used in 3D NAND Flash memory devices.

A gradual change in thermal oxide surface state from hydrophilic to hydrophobic was observed with time -delay in a clean room environment. Surface quality and reflectivity for the Al/Ti metal layers showed a strong dependency on the oxide surface state. From the hydrophilic oxide substrate, a lower (002) Ti preferred orientation was obtained than from hydrophobic ones. This resulted in a degraded (111) Al preferred orientation and rough metal surface. The RF-etch process increased the smoothness and hydrophobic surface property for the inter -metal dielectric (IMD) oxides, and therefore greatly improved Al/Ti surface quality. When conventional CMOS double layer metal interconnection process is performed, metal inter-line bridge yield was strongly affected by the surface state of substrate oxides.