Impurity diffusion induced by rapid thermal annealing (RTA) has been investigated for low energy B and BF2 implants in crystalline and preamorphized Si. A 50 keV 2×1015/cm2 Si self-implant was used for preamorphization. Samples were annealed with an oxide cap in an AG Associates HEATPULSE system (model 210T). Prior to the impurity depth profiling measurements, the SiO2 was removed with dilute HF. Significant B diffusion to theSiO2/Si interface was observed for a 1050°C/10 s anneal of 10 keV 3×1015/cm2 implanted;11B in crystalline and preamorphized Si. B interfacial concentrations were comparableto peak concentrations in unannealed samples. Diffusion of B and F to the SiO2/Si interface, and impurity gettering by ion straggling damage were observed for a 1050°C/10 s anneal of 45 keY 3×1O15/cm2 implanted 49BF2 in crystalline Si.though a loss F was apparent.
Depth profiles were determined with nuclear reaction analysis (NRA) [1-3], specifically the 11B(ρ,α0)8 Be(ER=163 key)  and 19F(ραγ)160 (ER - 340 keV)  reactions for 1lB and 19F profiling, respectively. This technique is sensitive to impurities at or near the surface and can reveal impurity diffusion to near-surface regions not usually detectable with secondary ion mass spectrometry (SIMS). NRA depth profiling has shownthat RTA can result in significant impurity diffusion to the SiO2/Si interface for B implanted in crystalline and preamorphized Si, and BF2 implanted in crystalline Si. Impurity concentrations at the interface are estimated to be in excess of 1020/cm3 for the implantation and annealing conditions used in this report. BF2 implanted in preamorphized Si showed greatly reduced impurity concentrations at the interface. A knowledge of the impurity concentrations at the substratesurface or the SiO2/Si interface becomes increasingly important as device dimensions decrease. Matrix effects make such measurements difficult with SIMS.