The microtexture of thin film aluminum has been studied using Electron Backscatter Diffraction (EBSD). The results indicate that, while the overwhelming majority of polycrystallite grains have a <111> fiber texture with the < 111 > axis within -5° of the surface normal, 1-2 % of the grains deposited on SiO2 show large deviations off of this axis. The off-texture grains are typically much smaller than those that are <111> textured. These observations have been made for Al(Cu) films with several different Cu concentrations and for different substrate materials. The statistical distributions of the orientations in the different cases are presented. Electrical stressing of 0.8 um Al(0.5%Cu) lines resulted in elimination of the small number of grains with off-<l 11> orientation.