34 results
Materials challenges in three-dimensional integrated circuits
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- MRS Bulletin / Volume 40 / Issue 3 / March 2015
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- 10 March 2015, pp. 219-222
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Appendix E - Terrace size distribution in Si MBE
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2 - Thin-film deposition
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Contents
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15 - Reliability science and analysis
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Index
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9 - Grain-boundary diffusion
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5 - Applications of the diffusion equation
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Appendix C - Derivation of Huntington's electron wind force
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Appendix F - Interdiffusion coefficient
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8 - Interdiffusion and reaction in thin films
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14 - Stress migration in thin films
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13 - Thermomigration
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Frontmatter
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6 - Elastic stress and strain in thin films
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10 - Irreversible processes in interconnect and packaging technology
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Appendix G - Tables of physical properties
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4 - Atomic diffusion in solids
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1 - Thin-film applications to microelectronic technology
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