In this paper, using chemical etching, atomic force microscope (AFM) and High- resolution X-ray diffraction (HRXRD), we report a study of the effect of various small miscuts of (0001) sapphire substrate (<1°) and the way to further improve the material quality. A set of AlN epilayers and AlN/AlxGa1-xN Superlattices (SLs) were grown by Migration-enhanced Metalorganic Chemical Vapor Deposition (MEMOCVD) on vicinal (0001) sapphire substrates. The threading dislocation density was found to be very sensitive to the miscut angles. The etch pit density reduced to 7×106 cm-2 for normal-oriented (0°-off) from the starting value of 7×107 cm-2 for 0.5°-off. We found the surface morphologies can be easily controlled by the different substrate miscut angles. The 1-2 Monolayers (MLs) step flow morphology for normal- oriented substrate changed to step bunches of 10 MLs height for 0.5°-off substrate. Correspondingly, AFM Root Mean Square (RMS) increased from 1.52 to 9.15 Å with a 5um×5um scan. This finding may help enhance the quality of full structure UVLED material and eventually improve the lifetime of UVLEDs.

We report progress in growing non-polar a-plane III-nitride films and heterostructures over a-plane 4H-SiC. a-plane SiC is more closely lattice-matched to a-plane GaN than is r-plane sapphire. Consequently, better structural quality a-plane nitride films may result over a-plane SiC substrates. By migration enhanced metalorganic chemical vapor deposition (MEMOCVD), an atomically smooth (1120)AlN layer with RMS roughness of 0.3nm was obtained. From the results of XRD, the structural defects in the AlN layer on SiC substrates were strongly reduced compared to those grown on r-plane sapphire. Also by applying our selective area lateral epitaxy (SALE) growth procedure, we achieved high structural and optical quality a-plane GaN films on 4H-SiC with RMS roughness only 0.4nm. Therefore, non-polar III-nitride films and heterostructures on SiC substrates are promising building blocks for realizing high performance polarization-free devices.

The comparative study of the DC parameters and RF power stability of nitride-based conventional HFETs and Metal-Oxide-Semiconductor HFETs (MOSHFETs) is presented. The average lifetime under DC stress is estimated to be as high as 2.5 years at room temperature. Under the large-signal RF stress, the gate leakage current of conventional HFETs increases significantly with time showing faster degradation as compared to DC stressing. MOSHFETs demonstrate superior RF performance stability, which perfectly correlates with the DC stability data. It is shown that in conventional HFETs, the combination of the self-heating and positive dynamic gate bias leads to the defect accumulation in the AlGaN barrier under the gate. In MOSHFETs, the absence of the gate leakage is a key to stable RF performance.

AlxGa1-xN layers grown by MOCVD on sapphire substrates have been tested using the surface acoustic wave and guided optical wave techniques. Samples with molar fraction of Al up to 0.36 have been investigated. The parameters S11 of single surface acoustic wave transducers and S12 of two-port devices have been measured with the network analyzer. The values of the surface acoustic wave velocity and electromechanical coupling coefficient for the layer-substrate structure have been extracted and calculated using material parameters available from literature. The attenuation of guided optical waves along the propagation track in AlxGa1-xN layers has been measured using the CCD imaging technique. The attenuation dependence on the mode order and layer thickness has been studied. Our results show that the properties of AlxGa1-xN that determine surface acoustic wave and guided optical wave propagation are similar to the properties of GaN films within a relatively wide range of x up to x =0.36.

A photoluminescence from a multiquantum GaN/InxGa1−xN/GaN well structure (x varies between 0.1 to 0.4) was investigated at various temperatures, pumping powers. While the temperature dependence of the peak position indicates normal band to band character of radiative recombination, the large pumping power induced “blue”shift of the peak position (up to 200 meV) can be observed. This kind of shift cannot be easily explained by the band tailing effect but is most likely the result of the screening of the strain-induced piezoelectric field. By evaluating the theoretical values of the piezoelectric filelds in the quantum well, we can show that in order to account for the experimental results we have to assume the partial relaxation of the strain.

We have studied the pressure dependence of photoluminescence for various InGaN quantum wells of different Indium compositions. In contrast to classical quantum well systems such as GaAs/AlGaAs, the pressure coefficients of the photoluminescence peak position of wells of similar parameters can vary greatly, depending on conditions of growth. Generally, the pressure coefficient of the emission peak is much lower than the one predicted for a GaN-InN system. We show that this behavior can be related in most cases to the influence of the thick GaN layer compressibility on the strain in the InGaN quantum wells. However, in some cases (Nichia devices), the pressure coefficient of the emission peak seems to be unrelated to the shift of the energy gap of the material, suggesting the involvement of strongly localized electronic states

A GaN/AlxGalxN multi-quantum well test structure with Al concentrations 0 ≤ xAl ≤ 1 was utilized to investigate the growth of AlxGal–xN barrier layers deposited by metal organic chemical vapor deposition (MOCVD). A transition from a two dimensional (2D) to a three dimensional (3D) growth mode was observed in AlxGa1–xN barriers with XAl ≥ 0.75. It is argued that the transition occurs because of growth at temperatures that are low compared with the materials melting points Tmelt. The resulting rough AlxGa1–xN surfaces can be planarized by overgrowth with GaN. Quantitative high resolution electron microscopy (HREM) was applied to measure composition and strain profiles across the GaN/AlxGa1−xN stacks at an atomic level. The measurements reveal a substantial variation of lattice constants at the AlxGa1−xN/GaN interfaces that is attributed to an Al accumulation.

Silicon carbide films have been grown on 6H-SiC (0001) and Si (001) wafers by laser ablation using an excimer laser. The films were deposited at heater plate temperatures between 970° C to 1270° C. Film composition, morphology and polytypism were determined by Auger electron spectroscopy, atomic force microscopy and high resolution transmission electron microscopy (TEM). In the course of these experiments growth of 2H-SiC on 6H-SiC was observed at the highest heater plate temperatures. Cross-sectional TEM images clearly show the symmetry of a film grown at 1270° C as c-axis oriented 2H-SiC containing columnar grains with average diameter of 20 nm and length of 100 nm.