5 results
Copper Migration During Tungsten via Formation
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- Journal:
- MRS Online Proceedings Library Archive / Volume 1249 / 2010
- Published online by Cambridge University Press:
- 01 February 2011, 1249-F01-08
- Print publication:
- 2010
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Effect of Dielectric Capping Layer on TDDB Lifetime of Cu Interconnects in SiOF
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- Journal:
- MRS Online Proceedings Library Archive / Volume 1156 / 2009
- Published online by Cambridge University Press:
- 31 January 2011, 1156-D06-08
- Print publication:
- 2009
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Improved Electromigration Lifetime for Copper Interconnects using Tantalum Implant
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- Journal:
- MRS Online Proceedings Library Archive / Volume 990 / 2007
- Published online by Cambridge University Press:
- 01 February 2011, 0990-B06-06
- Print publication:
- 2007
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Thermal Oxidation of Ni and Co Alloys Formed by Electroless Plating
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- Journal:
- MRS Online Proceedings Library Archive / Volume 914 / 2006
- Published online by Cambridge University Press:
- 01 February 2011, 0914-F05-09
- Print publication:
- 2006
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Deep Level Transient Spectroscopy of Defects Induced by the Combination of CF4 Reactive Ion Etching and Oxidation in Metal-Oxide-Silicon Capacitors.
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- Journal:
- MRS Online Proceedings Library Archive / Volume 148 / 1989
- Published online by Cambridge University Press:
- 25 February 2011, 421
- Print publication:
- 1989
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