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More people remain in the workforce into their late life as people’s life expectancy increases. This study examined the relationship between work stress and depressive symptoms of older workers in mainland China, focusing on the interplay between work stress with family and community factors in three (i.e., urban, rural, and migrant) settings.
National representative survey data on the Chinese labor force collected by the Social Science Research Center of Sun-Yetsen University in 2014 were used. The sample consisted of 5,751 workers aged 50 and above recruited from 29 out of 31 provinces in mainland China.
Work stress had a consistent and robust effect on depressive symptoms across older worker groups. Moreover, it interacted with family and community factors differentially in three settings. For migrant older workers, work stress was a dominant factor affecting their depressive symptoms. Among rural older workers, the influence of work stress on depressive symptoms depended on their family debt and neighborhood cohesion levels.
Stressors from work, family, and community comprised a general model that explains depressive symptoms in Chinese older workers. Interventions or service programs aimed at reducing work stress and improving mental health among older adults should consider the complexity of intertwining family and community dynamics as well as respective strengths in urban, rural, and migrant communities.
People who eat alone, which is becoming a new trend owing to the increasing proportion of one-person households in Korea, are more likely to become overweight and obese. Therefore, we investigated the association between having a dinner companion and BMI.
A linear regression model adjusted for covariates was utilized to examine the association between having a dinner companion and BMI. Subgroup analyses were performed, stratified by age group, gender, household income, educational level and occupation.
We used the data from the Korean Health and Nutrition Examination Survey VI. Our primary independent variable was having a dinner companion while the dependent variable was BMI.
In total, 13303 individuals, aged 20 years or over, were analysed.
Compared with the solo eating group, BMI was lower in the family dinner group (β=−0·39, P<0·01) but not in the non-family dinner group (β=−0·06, P=0·67). The subgroup analysis revealed that the difference in BMI was most significant in young generations, such as those aged 20–29 years (β=−1·15, P<0·01) and 30–39 years (β=−0·78, P=0·01).
We found that people who eat dinner alone are more likely to become overweight and obese than those who eat with their family. This association was stronger in males and young adults than their counterparts. Considering the increasing trends in the proportion of single-person households and solo eating, appropriate intervention is needed.
To enhance the reliability of Pb-free solders in high temperature and high humidity conditions, the minor alloying elements of Be and Co are investigated in terms of the growth of Sn whiskers and various properties of Sn-based Pb-free solders. Sn whisker growth is suppressed by adding up to 0.02 wt% Be to Sn-based solders. Adding Be and Co can effectively reduce the undercooling of Sn–1.0Ag–0.5Cu (wt%) solders. And the microstructures of Sn–1.0Ag–0.5Cu–0.02Be solders are similar to those of Sn–1.0Ag–0.5Cu. Furthermore, adding Co to solders increases the microhardness number as a result of the solid solution hardening. Adding Be causes no changes in the morphology or thickness of Cu6Sn5 at the Cu/OSP (organic solderability preservative) under bump metallurgy interface. However, the scallop-like Cu6Sn5 microstructure changes to a flat (Cu,Co)6Sn5 microstructure when 0.05 wt% of Co is added to Sn–1.0Ag–0.5Cu–0.02Be solders.
Rapid thermal annealing (RTA) processing under N2 and O2 ambient is suggested and characterized in this work for improvement of SiCOH ultra-low-k (k = 2.4) film properties. Low-k film was deposited by plasma-enhanced chemical vapor deposition (PECVD) with decamethylcyclopentasiloxane and cyclohexane precursors. The PECVD films were treated by RTA processing in N2 and O2 environments at 550 °C for 5 min, and k values of 1.85 and 2.15 were achieved in N2 and O2 environments, respectively. Changes in the k value were correlated with the chemical composition of C–Hx and Si–O related groups determined from the Fourier transform infrared (FTIR) analysis. As the treatment temperature was increased from 300 to 550 °C, the signal intensities of both the CHx and Si–CH3 peaks were markedly decreased. The hardness and modulus of the film processed by RTA have been determined as 0.44 and 3.95 GPa, respectively. Hardness and modulus of RTA-treated films were correlated with D-group [O2Si–(CH3)2] and T-group [O3Si–(CH3)] fractions determined from the FTIR Si–CH3 bending peak. The hardness and modulus improvement in this work is attributed to the increase of oxygen content in (O)x–Si–(CH3)y by rearrangement.
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