Recently, a wide range of new applications of diamond materials such as spintronics, field emission, and bio-sensing have been proposed. These applications often require the precise patterning of diamonds, which is not trivial because diamonds are the hardest materials known in nature. Among various patterning techniques, the focused ion beam milling method has been proven to provide flexibility as well as high resolution in the pattern design. In this study, a focused beam of 30 kV Ga+ ions was utilized to create sub-micrometer size patterns out of crystalline diamonds. The sputtering rate, re-deposition, and surface roughening of diamond structure have been closely monitored with various milling parameters during the milling process. Our study revealed a low milling yield of 0.02 μm3/nC, high Ga content re-deposition, and the formation of sub-micron scale terracing on the sidewall of patterned diamonds.