Integration of piezoelectric Pb(Zr,Ti)O3 (PZT) thin films promises to provide silicon-based microelectromechanical systems (MEMS) with added functionality. PZT films with compositions near the tetragonal/rhombohedral morphotropic boundary have been deposited on iridium-coated Si substrates by a thermal chemical vapor deposition (CVD) process using flash vaporized metalorganic precursors. Process variables including (A-site)-to-(B-site) ratios in the precursor mix and deposition times have been surveyed. Stoichiometric, perovskite films with nominal Zr/Ti ratios ranging from 40/60 to 60/40 were obtained. Parallel-plate capacitor structures have been fabricated by depositing Pt top electrodes using e-beam evaporation through shadow masks. Ferroelectric hysteresis loops were measured using a standard ferroelectric tester. Remenant polarization values in the range of 20∼30 μC/cm2 were obtained. For films of 0.5 μm or thicker, piezoelectric hysteresis loops were characterized by dual-beam interferometry. Longitudinal piezoelectric coefficients (d33) of 30∼60 pm/V were observed on the films deposited between 550 and 600°C.

Incorporation of ferroelectric thin films into integrated microelectronics requires deposition temperatures compatible with back-end processing. Pb(Zr,Ti)O3 (PZT) thin films have been deposited at low temperatures by a thermal chemical vapor deposition process using flash-vaporized metalorganic precursors. Deposition temperatures, A-site to B-site ratios in the precursor solution, and bottom electrodes have been surveyed. Stoichiometric perovskite films with (Zr/Ti) ratios ranging from 20/80 to 50/50 were obtained. Films deposited at temperatures below 500°C possess very fine grain structures. Capacitor structures were fabricated by depositing top electrodes using electron-beam evaporation, followed in some cases by a post-electrode anneal at 650°C. Remanent polarizations greater than 20 μC/cm2 were observed on films deposited on Pt at temperatures as low as 475°C. Perovskite films were obtained on Ir electrodes at temperatures as low as 450°C, with remanent polarization greater than 10μC/cm2 in the as-deposited condition.

We have applied real time spectroellipsometry (RTSE) to study hydrogenated amorphous silicon (a-Si:H) solar cells fabricated in the Cr/n-i-p configuration using plasma-enhanced chemical vapor deposition (PECVD) in a single-chamber system. The microstructural evolution of the n-, i-, and p-layers of the devices has been determined, including the thicknesses of the bulk, interface, and surface roughness layers versus time. The optical properties of the individual layers, including the dielectric functions and optical gaps, have also been obtained in the same analysis. In this study, we have focused on i/p interface formation and, in particular, on the nucleation process for differently-prepared a-Si:C:H and mixed-phase μc-Si:H/a-Si1-xCx:H p-layers on the a-Si:H i-layer. From the thickness dependence of the p-layer void volume fraction, we can obtain an estimate of the thickness at which nuclei make contact to form a continuous film. For the mixed-phase p-layers, the nuclei contact thickness can be reduced by exposing the i-layer to a H2-plasma prior to p-layer deposition. We have found that for similarly-prepared p-layers this reduction in contact thickness leads to an increase in open-circuit voltage of the solar cell

We have developed a real time spectroellipsometry data analysis procedure that allows us to characterize compositionally- graded amorphous semiconductor alloy thin films prepared by plasma-enhanced chemical vapor deposition (PECVD). As an example, we have applied the analysis to obtain the depth-profile of the optical gap and alloy composition with ≤15 Å resolution for a hydrogenated amorphous silicon-carbon alloy (a-Si1−xCx:H) film prepared by continuously varying the gas flow ratio z=[CH4]/{[CH4]+[SiH4]} in the PECVD process. The graded layer has been incorporated at the p/i interface of widegap a-Si1−xCx:H (x∼0.05) p-i-n solar cells, and consistent improvements in open-circuit voltage have been demonstrated. The importance of the graded-layer characterization is the ability to relate improvements in device performance directly to the physical properties of the interface layer, rather to the deposition parameters with which they were prepared.

We have applied real time spectroscopie ellipsometry (RTSE) to monitor the successive growth of p-type a-Si1-xCx:H and i-type a-Si:H on specular SnO2:F (i.e., the superstrate solar cell configuration) in a single-chamber deposition system. Both the microstructural evolution, which includes the surface roughness and bulk layer thicknesses versus time and bulk layer void volume fraction, as well as the optical properties, which include the dielectric function (1.5–4.0 eV) and optical gap of the individual layers, were determined from RTSE data collected during growth. The accuracy of our approach is demonstrated by correlating structural parameters obtained both by RTSE and atomic force microscopy. Based on prior information deduced by RTSE, the TCO/p/i structure was fabricated with optimized procedures that have sought to minimize TCO/'p and p/i interfacial problems. These studies illustrate that RTSE can be a valuable tool for identifying problems in the fabrication of a-Si:H solar cells and ultimately improving cell performance.