4 Nines (99.99%) Cd and Te were purified to the semiconductor grade 6 Nines ∼ 7 Nines purity materials by the distillation and the zone melting processes, in order to be used for the growth of CdTe single crystal. The CdTe single crystal of 100 mm in diameter and 18kg in weight was successfully grown by the traveling heater method (THM). The shape of the growth interface had the key role for the single crystal growth. The distribution of the Te inclusion size was measured by IR microscopy. The uniformity of mobility-lifetime products and energy resolution in the wafer were also evaluated. The CdTe X-ray flat panel detector (FPD) was developed using the THM grown CdTe single crystal wafer. The CdTe pixel detectors with 100 mm pixel pitch were flip-chip bonded with the C-MOS readout ASIC and lined up on the print circuit board to cover the active area of 77 mm × 39 mm. The evaluation results showed that the CdTe X-ray FPD is promising as the imager for the non-destructive testing.

GaP1-x-yAsyNx. (x ∼,2.3%, 0< y <19%) quaternary alloy semiconductor films on GaP substrates have been successfully grown by metalorganic vapor phase epitaxy (MOVPE). With the fixed supplies of trimethylgallium(TMG), AsH3 and dimethylhydrazine(DMHy) during the growth, the As concentration in the solid increased with increasing AsH3 supply, while the N concentration was almost unaffected. It has been demonstrated that the crystalline quality of the alloy films is much improved with the close lattice-matching to the GaP substrate, giving a superior surface morphology without any cross-hatches, a much narrower x-ray diffraction linewidth, and a significantly higher photoluminescence(PL) intensity.

The interaction between EL5 and EL6 in the n-type bulk GaAs have been observed by using isothermal constant-capacitance voltage transient spectroscopy (CCVTS). Each CCVTS spectrum of EL5 and EL6 was broader than a theoretical one expected for a single level, and was found to be consistently interpreted by two main trap components. With the increase of the filling pulse duration in a wide range, one component of EL6 decreased to about 50 % of its initial value, while one component of EL5 increased and saturated. This variation in peak heights could be reversed by controlling electron occupation fractions of EL5 and EL6 by application of two adjacent filling pulses. Such interaction between both levels was commonly observed in n-type bulk GaAs independent of carrier density.

We apply the reflectance microwave probe (RMP) method to characterize the surface condition of the sulfur-treated GaAs. Undoped semi-insulating GaAs wafers are dipped in (NH4)2S or (NH4)2Sx [1<x≦3] after an etching. The intensity of the reflected microwave under He-Ne laser (λ=633nm) irradiation is proportional to the excess carrier density, which strongly depends on the surface condition. The (NH4)2Sx treatment increases the RMP signal intensity, while no significant change in the signal intensity is observed after the (NH4)2S treatment. The signal intensity of the (NH4)2Sx-treated samples is decreased by the annealingyhe results observed in this study are consistent with those previously found with other measurement methods. This method will be able to in-situ evaluate the surface condition of GaAs during the device fabrication process.

Properties of medium-deep traps in n-type undoped GaAs crystals grown by arsenic-pressure controlled Czochralski (PCZ) method were studied by using capacitance transient spectroscopy (CTS) and temperature-dependent Hall (TDH) measurement. EL3 and EL6-like (EM2) traps were dominant medium-deep traps in D LTS measurements. The dependence of EM2 peak height on the duration of filling pulse and the detailed analysis of CTS showed that the trap EM2 spectrum consisted of three electron traps which had thermal emission activation energies of approximately 0.35 eV and various capture cross sections with activation energies for electron capture. On the other hand, the trap EL6 spectrum in n-type LEC GaAs was described by two levels of traps with activation energies of 0.32 eV and 0.33 eV for electron emission, respectively. It was concluded that so-called EL6 formed a family and some of its components were classified as defects with large lattice relaxation.