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A comparative study of a new microscale technique and conventional bending techniques for evaluating the interface adhesion strength in IC metallization systems
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- Journal:
- Journal of Materials Research / Volume 25 / Issue 10 / October 2010
- Published online by Cambridge University Press:
- 31 January 2011, pp. 1917-1928
- Print publication:
- October 2010
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A Trial for Micro-Scale Evaluation of Adhesion Strength around Cu Metallization Systems
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- Journal:
- MRS Online Proceedings Library Archive / Volume 990 / 2007
- Published online by Cambridge University Press:
- 01 February 2011, 0990-B10-04
- Print publication:
- 2007
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- Article
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