Impurity effects were investigated in (Ba,Sr)TiO3 (BST) systems in order to suppress leakage currents under relatively low oxygen pressure conditions by Pulsed Laser Deposition (PLD). We tried to dope transition metals, such as Mo, Mn, Cr, W and Fe into the BST target and used the targets to fabricate the films. By measuring electrical properties, we found Fe-doping had a significant effect on suppressing leakage current. Subsequently, we changed the amount of Fe doping from 0.1mol% to 6%. As a result, with post annealing, the sample with Fe:4% showed the lowest leakage current among those analyzed. Even without post annealing, the sample with Fe:6% showed the lowest leakage current. As for the dielectric constants, they decreased as the doping increased. At most, a 30% reduction was observed, compared with non-doped BST. XANES (X-ray Absorption Near Edge Structures) results indicated that the valency of the Fe ion was 3+ and located at the B-site of BST.

Electrical properties of PIN photodiodes fabricated on the bonded silicon on insulator (SOI) wafers annealed at 900°C for 5 seconds were evaluated in order to investigate the effect of rapid thermal annealing (RTA) on SOI wafers. Traps in the SOI layers with different thicknesses (10,30,100 μm) were investigated using the deep level transient spectroscopy (DLTS) method. In the SOI layer with a thickness of 100 μm, a trap with deep energy level (about Ec-Et=0.55 eV) was observed and the concentration of the trap decreased from 5.0 × 1011 cm−3 to 1.5 × 1011 cm−3 by RTA. For PIN photodiodes on the 100 μm-thick SOI layer, the dark current decreased from 2 × 10−9 A to 6 × 10−10 A, and sensitivity uniformity for a 35 μmφ light spot and spectral responses were both improved by RTA. Lifetimes were obtained from open-circuit voltage (Voc) decay curves for 940 nm and 655 nm light, and they increased from 37 μs to 57 μs and from 47 μs to 62 μs, respectively, by RTA. For thinner SOI layers (thickness=10, 30 μm), PIN photodiodes have good uniformity and low dark current, and their characteristics were not changed by RTA.

The surface properties of silicon are investigated by the noncontact laser (λ=774nm)/microwave method. The effective surface recombination velocity (Seff) at an n+n high-low junction interface is estimated by fitting the experimental decay curve for excess carriers with the theoretical decay curve. The results show that Seg decreases as the dopant concentration increases and that Seff at the n+n high-low junction formed with a dose of 1×l015 ions/cm2 has values lower than 1 cm/s. And it is shown that Scff is inversely proportional to the potential barrier height of the n+n high-low junction. Similar results are obtained using an N2 laser (λ=337.1nm) instead of a laser diode (λ=774nm, 904nm) as a carrier excitation pulse source.

The surface recombination of GaAs which has a high carrier concentration layer (HCCL) formed by Si+ implantation has been investigated using the reflectance microwave probe (RMP) method. The RMP method enables us to evaluate the surface property of GaAs contactlessly and easily. The experimental results of the samples which were implanted with doses ranging from 1.0×1011 to 3.9×1012cm-2 at an energy of lOOke V indicate that the effective surface recombination velocity decreases with dosage because of HCCL formed after the annealing. On the other hand, the results of the samples which were implanted with a dose of 3.9 × 1012cm-2 at energies ranging from 30 to 180keV indicate that the effective surface recombination velocity increases with energy for energies larger than 50keV. We understood the reason by comparing with the numerical calculation results of an effective surface recombination velocity at a high-low junction interface.