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3D Process Integration – Requirements and Challenges
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- Journal:
- MRS Online Proceedings Library Archive / Volume 1112 / 2008
- Published online by Cambridge University Press:
- 01 February 2011, 1112-E01-01
- Print publication:
- 2008
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Flip Chip Reliability of GaAs on Si Thinfilm Substrates Using AuSn Solder Bumps
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- Journal:
- MRS Online Proceedings Library Archive / Volume 863 / 2005
- Published online by Cambridge University Press:
- 01 February 2011, B10.1
- Print publication:
- 2005
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- Article
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